7 Other Function Telecom Interface ICs 14

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGB707L7ESDE6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q101

3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

GOLD PALLADIUM

DUAL

R-PDSO-N7

1

.5 mm

1.3 mm

2 mm

MAX3266C/D

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

7

DIE

RECTANGULAR

UNSPECIFIED

YES

1

50 mA

3.3 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N7

1

Not Qualified

e0

HMC570

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

7

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.5 V

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N7

Not Qualified

e4

HMC571

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

7

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.5 V

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N7

Not Qualified

e4

HMC572

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

7

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.5 V

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N7

Not Qualified

e4

L3234

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

7

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

.003 mA

5 V

5

FLANGE MOUNT

GWZIP7H,.08,.26

Telephone Circuits

70 Cel

0 Cel

ZIG-ZAG

R-PZFM-T7

Not Qualified

L3234T

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

7

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

.003 mA

5 V

5

FLANGE MOUNT

GWZIP7H,.08,.26

Telephone Circuits

70 Cel

0 Cel

ZIG-ZAG

R-PZFM-T7

Not Qualified

BGB707L7ESD

Infineon Technologies

TELECOM CIRCUIT

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

GOLD PALLADIUM

DUAL

R-PDSO-N7

1

.5 mm

1.3 mm

Not Qualified

2 mm

BGM704N7

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

DUAL

R-PDSO-N7

.4 mm

1.3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2 mm

BGM1034N7

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N7

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

BGM1034N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N7

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

MAX3267C/D

Maxim Integrated

TELECOM CIRCUIT

NO LEAD

7

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

TIN LEAD

UPPER

R-XUUC-N7

1

Not Qualified

e0

MAX3267E/D

Maxim Integrated

TELECOM CIRCUIT

NO LEAD

7

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

TIN LEAD

UPPER

R-XUUC-N7

1

Not Qualified

e0

MAX3963C/D

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

7

DIE

SQUARE

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

S-XUUC-N7

1

Not Qualified

e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.