Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Murata Manufacturing |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-N72 |
3 |
1.1 mm |
7.3 mm |
10 |
250 |
7.9 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
SILVER |
QUAD |
S-PQCC-N72 |
1 mm |
10 mm |
e4 |
10 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
72 |
LGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-XBGA-N72 |
3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
SILVER |
QUAD |
S-PQCC-N72 |
1 mm |
10 mm |
e4 |
10 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N72 |
1 |
1 mm |
10 mm |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
SILVER |
QUAD |
S-PQCC-N72 |
1 mm |
10 mm |
e4 |
10 mm |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.15 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
480.24 Mbps |
S-PQCC-N72 |
3 |
1 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
12500 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N72 |
3 |
2 V |
e4 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
12500 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
12500 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
2 V |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12500 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12500 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12500 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
12500 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.9 V |
1.9,3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
10000 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12500 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N72 |
3 |
2 V |
e4 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
2 V |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.9 V |
1.9,3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
10000 Mbps |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.15 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12500 Mbps |
S-PQCC-N72 |
3 |
1 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.975 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.975 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
.19 mA |
1.8 V |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
.19 mA |
1.8 V |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-55 Cel |
SILVER |
QUAD |
S-PQCC-N72 |
1 mm |
10 mm |
e4 |
10 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-55 Cel |
SILVER |
QUAD |
S-PQCC-N72 |
1 mm |
10 mm |
e4 |
10 mm |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
GULL WING |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-G72 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
GULL WING |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-G72 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
GULL WING |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-G72 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
GULL WING |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
FIBER OPTIC |
UNSPECIFIED |
R-XXFO-G72 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
BALL |
72 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.5,3 |
GRID ARRAY, FINE PITCH |
BGA72,9X9,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B72 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N72 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
R-XQCC-N72 |
3 |
e3 |
NOT SPECIFIED |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
R-XQCC-N72 |
3 |
e3 |
NOT SPECIFIED |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
R-XQCC-N72 |
3 |
e3 |
NOT SPECIFIED |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
3.3 |
CHIP CARRIER |
LCC72,.39SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N72 |
3 |
Not Qualified |
e3 |
260 |
||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
R-XQCC-N72 |
3 |
e3 |
NOT SPECIFIED |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8,3.3 |
CHIP CARRIER |
LCC72,.39SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N72 |
3 |
Not Qualified |
e3 |
260 |
|||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
NOT SPECIFIED |
260 |
10 mm |
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|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
R-XQCC-N72 |
3 |
e3 |
NOT SPECIFIED |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
NO LEAD |
72 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
3.3 |
CHIP CARRIER |
LCC72,.39SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N72 |
3 |
Not Qualified |
e3 |
260 |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.