80 Other Function Telecom Interface ICs 63

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

ATPL250A-AKU-R

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G80

1.6 mm

12 mm

e3

12 mm

SIM5320E

Simcom Wireless Solutions

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

80

QMA

SQUARE

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

80 Cel

-30 Cel

QUAD

3.6 Mbps

S-XQMA-N80

TLK2711AJRZQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B80

3

1 mm

5 mm

Not Qualified

e1

30

260

5 mm

SIM5320A

Simcom Wireless Solutions

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

80

QMA

SQUARE

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

80 Cel

-30 Cel

QUAD

3.6 Mbps

S-XQMA-N80

AD6676BCBZRL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

80

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.1 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

1

.66 mm

5.04 mm

e1

30

260

4.29 mm

AFE4300PNR

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BINARY/TWOS COMP

2

.00097 mA

3.3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Codecs

.5 mm

70 Cel

16

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

VOLTAGE

3

1.6 mm

12 mm

Not Qualified

DIFFERENTIAL

3.4 V

e4

30

260

12 mm

TLK2711JRGQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B80

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

TLK2711JRZQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B80

3

1 mm

5 mm

Not Qualified

e1

30

260

5 mm

AFE4300PN

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BINARY/TWOS COMP

2

.00097 mA

3.3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Codecs

.5 mm

70 Cel

16

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

VOLTAGE

3

1.6 mm

12 mm

Not Qualified

DIFFERENTIAL

3.4 V

e4

30

260

12 mm

LM96550SQX/NOPB

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

-10 V

10 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N80

3

.8 mm

12 mm

e3

30

260

12 mm

LM96551SQ/NOPB

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N80

3

.8 mm

12 mm

30

260

12 mm

LM96551SQX

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N80

.8 mm

12 mm

12 mm

TLFD500PN

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

1.1 Mbps

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

12 mm

LM96551SQE/NOPB

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N80

3

.8 mm

12 mm

e3

30

260

12 mm

LM96551SQX/NOPB

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N80

3

.8 mm

12 mm

30

260

12 mm

LM96551SQ

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N80

.8 mm

12 mm

12 mm

TRF5001GQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BUTT

80

VFLGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

65 Cel

0 Cel

BOTTOM

S-PBGA-B80

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

LM96550SQ

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

10 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N80

.8 mm

12 mm

12 mm

LM96550SQX

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

10 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N80

.8 mm

12 mm

12 mm

TRF2443IPFP

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

3

1.2 mm

12 mm

Not Qualified

e4

30

260

12 mm

LM96550SQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

10 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N80

.8 mm

12 mm

12 mm

TCM4400

Texas Instruments

TELECOM CIRCUIT

OTHER

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-25 Cel

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

12 mm

TRF2443IPFPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

3

1.2 mm

12 mm

Not Qualified

e4

30

260

12 mm

LM96551SQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N80

.8 mm

12 mm

12 mm

TLK2541PFPG4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

3

1.2 mm

12 mm

Not Qualified

e4

30

260

12 mm

TLK2541PFPRG4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

3

1.2 mm

12 mm

Not Qualified

e4

30

260

12 mm

TLK2541PFP

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

.31 mA

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

3

1.2 mm

12 mm

Not Qualified

e4

30

260

12 mm

TLK2711GQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B80

1 mm

5 mm

Not Qualified

5 mm

TLV320VD30PN

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

2.5/3.3,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

52 Mbps

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

12 mm

TLK2541PFPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

3

1.2 mm

12 mm

Not Qualified

e4

30

260

12 mm

AD6437

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G80

Not Qualified

SC2200A-00A00

Analog Devices

TELECOM CIRCUIT

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N80

.9 mm

11 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

SC2200A-00A00E

Analog Devices

TELECOM CIRCUIT

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N80

.9 mm

11 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

AD6620

Analog Devices

TELECOM CIRCUIT

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

S-PQFP-G80

Not Qualified

30

220

AD53/009-9

Analog Devices

TELECOM CIRCUIT

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK, LOW PROFILE

.65 mm

TIN LEAD

QUAD

S-PQFP-G80

1.6 mm

14 mm

Not Qualified

e0

14 mm

AD6440

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

.65 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G80

3.4 mm

14 mm

Not Qualified

14 mm

AD9857AST

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, LOW PROFILE

QFP80,.64SQ

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Tin/Lead (Sn85Pb15)

QUAD

S-PQFP-G80

3

1.6 mm

14 mm

Not Qualified

e0

30

240

14 mm

AD9389KSTZ-80

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

FLAT

80

QFF

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

FLATPACK

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-F80

3

1.6 mm

14 mm

Not Qualified

e3

260

14 mm

AD9857ASTZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, LOW PROFILE

QFP80,.64SQ

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G80

3

1.6 mm

14 mm

Not Qualified

e3

40

260

14 mm

ST75C540

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK, LOW PROFILE

.65 mm

70 Cel

0 Cel

QUAD

S-PQFP-G80

1.6 mm

14 mm

Not Qualified

14 mm

ST75C530

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

150 mA

5 V

FLATPACK, LOW PROFILE

.65 mm

70 Cel

0 Cel

QUAD

S-PQFP-G80

1.6 mm

14 mm

Not Qualified

14 mm

PCD6001H

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.5 V

2.5,3

FLATPACK

QFP80,.7X.9,32

Other Telecom ICs

.8 mm

70 Cel

-25 Cel

QUAD

R-PQFP-G80

Not Qualified

40

245

PCD6002H/F1

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

FLATPACK

.8 mm

70 Cel

-25 Cel

QUAD

R-PQFP-G80

3.2 mm

14 mm

Not Qualified

20 mm

PCD6003H

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.035 mA

2.5 V

2.5,3

FLATPACK

QFP80,.7X.9,32

Other Telecom ICs

.8 mm

70 Cel

-25 Cel

MATTE TIN

QUAD

R-PQFP-G80

Not Qualified

e3

PCD6002H/F1-T

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

FLATPACK

.8 mm

70 Cel

-25 Cel

QUAD

R-PQFP-G80

3.2 mm

14 mm

Not Qualified

20 mm

PSB2168

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.65 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G80

2.45 mm

14 mm

Not Qualified

e0

14 mm

PEB3465

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

3.3/5,+-5

FLATPACK

QFP80,.68SQ

Codecs

.65 mm

70 Cel

0 Cel

.1 dB

TIN LEAD

QUAD

S-PQFP-G80

2.45 mm

16-BIT

14 mm

Not Qualified

A/MU-LAW

e0

14 mm

YES

PSB4860

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.65 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G80

2.45 mm

14 mm

Not Qualified

e0

14 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.