84 Other Function Telecom Interface ICs 13

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

ST60-SIPT

Laird Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

84

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

UNSPECIFIED

866.7 Mbps

R-XXMA-N84

1.87 mm

13 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

PI2EQX4402DNBE

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

BALL

84

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B84

3

1.46 mm

9 mm

Not Qualified

e1

9 mm

STLC2500ATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

84

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.75 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B84

1.2 mm

6 mm

Not Qualified

6 mm

STLC2500

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

84

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.75 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B84

1.2 mm

6 mm

Not Qualified

e1

260

6 mm

STLC2500A

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

84

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.75 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B84

1.2 mm

6 mm

Not Qualified

6 mm

IMSC004-G20M

STMicroelectronics

MILITARY

PIN/PEG

84

PGA

SQUARE

CERAMIC

NO

CMOS

5 V

5

GRID ARRAY

PGA84,10X10

Other Telecom ICs

2.54 mm

125 Cel

-55 Cel

TIN LEAD

PERPENDICULAR

S-XPGA-P84

Not Qualified

e0

PI2EQX4402DNBEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

BALL

84

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B84

3

1.46 mm

9 mm

Not Qualified

e1

9 mm

HSP50210JC-52

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.225 mA

5 V

5

CHIP CARRIER

LDCC84,1.2SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-J84

4

4.57 mm

29.31 mm

Not Qualified

e0

29.31 mm

HSP50210JI-52Z

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.225 mA

5 V

5

CHIP CARRIER

LDCC84,1.2SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-J84

4

4.57 mm

29.31 mm

Not Qualified

e3

30

245

29.31 mm

HSP50110JI-52

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQCC-J84

4

4.57 mm

29.31 mm

Not Qualified

e0

29.31 mm

HSP50210JI-52

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.225 mA

5 V

5

CHIP CARRIER

LDCC84,1.2SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQCC-J84

4

4.57 mm

29.31 mm

Not Qualified

e0

29.31 mm

HSP50110JC-52

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-J84

4

4.57 mm

29.31 mm

Not Qualified

e0

29.31 mm

HSP50210JC-52Z

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.225 mA

5 V

5

CHIP CARRIER

LDCC84,1.2SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-J84

4

4.57 mm

29.31 mm

Not Qualified

e3

30

245

29.31 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.