Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,20LEAD(UNSPEC) |
2 mm |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
DUAL |
.3 Mbps |
R-XDMA-T20 |
24.4 mm |
e4 |
29.9 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3 |
3.45 mm |
18 mm |
250 |
31.4 mm |
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U-blox Ag |
TELECOM CIRCUIT |
NO LEAD |
18 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N18 |
2.7 mm |
9.7 mm |
10.1 mm |
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|
U-blox Ag |
GNSS Module |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
DUAL |
12 Mbps |
R-XDMA-N24 |
2.6 mm |
12.2 mm |
16 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3.45 mm |
18 mm |
31.4 mm |
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Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
34 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
DUAL |
6.8 Mbps |
R-XDMA-N34 |
3.4 mm |
19.13 mm |
26.12 mm |
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|
U-blox Ag |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N28 |
4 |
2.7 mm |
17 mm |
22.4 mm |
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|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
18 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N18 |
2.5 mm |
9.7 mm |
HEIGHT CAPTURED NOMINAL |
10.1 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
16 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3.45 mm |
18 mm |
31.4 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
33 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N33 |
19 mm |
25 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
16 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3 |
3.45 mm |
18 mm |
30 |
250 |
31.4 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3.45 mm |
18 mm |
31.4 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3 |
3.45 mm |
18 mm |
250 |
31.4 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
12.2 mm |
16 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100; TS 16949 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
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|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
18 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N18 |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
33 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N33 |
19 mm |
25 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
16 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.7 mm |
17 mm |
22.4 mm |
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|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
18 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N18 |
2.5 mm |
9.7 mm |
SEATED HGT-NOM; OPERATED WITH 2.8V TO 4.3V |
10.1 mm |
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Silicon Labs |
TELECOM CIRCUIT |
NO LEAD |
28 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
DUAL |
3 Mbps |
R-XDMA-N28 |
2.7 mm |
14.5 mm |
35.75 mm |
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|
Lantronix |
SERIAL DEVICE SERVER |
PIN/PEG |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
.921 Mbps |
R-XDMA-P24 |
11.7602 mm |
31.75 mm |
43.2308 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
PIN/PEG |
9 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
5.1 mm |
80 Cel |
-40 Cel |
DUAL |
R-XDMA-P9 |
11.68 mm |
35.3 mm |
40.64 mm |
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|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
2.4 mm |
12.2 mm |
OPERATES FROM 2.8V TO 3.4V SUPPLY |
16 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3 |
3.45 mm |
18 mm |
250 |
31.4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
PIN/PEG |
9 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
5.1 mm |
65 Cel |
-10 Cel |
DUAL |
R-XDMA-P9 |
11.68 mm |
35.3 mm |
40.64 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
PIN/PEG |
9 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
5.1 mm |
80 Cel |
-40 Cel |
DUAL |
R-XDMA-P9 |
11.68 mm |
35.3 mm |
40.64 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
PIN/PEG |
9 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
5.1 mm |
65 Cel |
-10 Cel |
DUAL |
R-XDMA-P9 |
11.68 mm |
35.3 mm |
40.64 mm |
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|
New Japan Radio |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
DMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
MICROELECTRONIC ASSEMBLY |
.5 mm |
105 Cel |
-40 Cel |
DUAL |
S-XDMA-N10 |
.63 mm |
2.5 mm |
HEAT SINK AVAILABLE |
2.5 mm |
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|
Broadcom |
TELECOM CIRCUIT |
NO LEAD |
10 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
DUAL |
R-XDMA-N10 |
1.03 mm |
2 mm |
2.5 mm |
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|
Broadcom |
TELECOM CIRCUIT |
NO LEAD |
10 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
DUAL |
R-XDMA-N10 |
1.03 mm |
2 mm |
2.5 mm |
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|
Broadcom |
TELECOM CIRCUIT |
NO LEAD |
10 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
DUAL |
R-XDMA-N10 |
.92 mm |
2 mm |
2.5 mm |
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|
Broadcom |
TELECOM CIRCUIT |
NO LEAD |
10 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
DUAL |
R-XDMA-N10 |
1.03 mm |
2 mm |
2.5 mm |
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|
Broadcom |
TELECOM CIRCUIT |
NO LEAD |
10 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
DUAL |
R-XDMA-N10 |
.92 mm |
2 mm |
2.5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.