FQFP Other Function Telecom Interface ICs 22

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
KSZ8695X	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	28 mm
AD6423	Analog Devices	TELECOM CIRCUIT		GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK, FINE PITCH			.5 mm				QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified				10 mm
AD6421AST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3 V	3	FLATPACK, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified				10 mm
AD6622AS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	-40 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified				20 mm
AD6439BS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	R-PQFP-G128		2.35 mm	14 mm	Not Qualified				20 mm
AD6624AS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	2.5 V	2.5,3.3	FLATPACK, FINE PITCH	QFP128,.67X.93,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified				20 mm
AD6624XS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified				20 mm
AD6422AST	Analog Devices	TELECOM CIRCUIT		GULL WING	144	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK, FINE PITCH			.5 mm				QUAD	S-PQFP-G144		1.6 mm	20 mm	Not Qualified				20 mm
AD6623AS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified	e0		240	20 mm
AD6623ASZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified	e3		260	20 mm
AD6439-2BS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	R-PQFP-G128		2.35 mm	14 mm	Not Qualified				20 mm
STLC1502D	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	HCMOS	2.5 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0			28 mm
STLC1502P	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	HCMOS	2.5 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified				28 mm
FC106/10	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64		2.45 mm	10 mm	Not Qualified	e0			10 mm
STLC1502	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e4			28 mm
VES1848-2	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified				28 mm
935264535557	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified				28 mm
PMB2408	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48			7 mm	Not Qualified				7 mm
TC35167F	Toshiba	TELECOM CIRCUIT		GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1				FLATPACK, FINE PITCH			.5 mm				QUAD	S-PQFP-G208		4.45 mm	28 mm	Not Qualified		NOT SPECIFIED	240	28 mm
HDMP-1536A	Broadcom	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3.3 V	3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G64		2.45 mm	10 mm	Not Qualified				10 mm
HDMP-0552	Broadcom	TELECOM CIRCUIT		GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	3.3 V	3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	ATM/SONET/SDH ICs	.5 mm		0 Cel		QUAD	S-PQFP-G64		2.45 mm	10 mm	Not Qualified				10 mm
S5N8950	Samsung	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	176	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.8 V	1.8,1.8/3.3	FLATPACK, FINE PITCH	QFP160,1.0SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G176		3 mm	24 mm	Not Qualified				24 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.