HLSSOP Other Function Telecom Interface ICs 16

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3774CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3772CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3774CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3773CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3773CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3775CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3774CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3			4.89 mm
MAX3774CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3			4.89 mm
MAX3772CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3772CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3773CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3775CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3775CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3773CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3775CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel		DUAL	R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.89 mm
MAX3772CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.