HTFQFP Other Function Telecom Interface ICs 38

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SN65DSI83TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
SN65DSI84TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
SN65DSI86IPAPQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
SN65DSI86IPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
SN65DSI85TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
ADV7619KSVZ-P	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G128	3	1.2 mm	14 mm		e3		260	14 mm
ADV7619KSVZ	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G128	3	1.2 mm	14 mm		e3	20	260	14 mm
TRF4140QPHNRQ1	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQFP-G48	3	1.2 mm	7 mm		e4	30	260	7 mm
SN75FC1000PJD	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			.25 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
SN75FC1000BPJD	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		GAAS			.31 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TLK100PHPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	1.1,1.8,3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e4	NOT SPECIFIED	260	7 mm
AFE8221IRFPQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	20 mm	Not Qualified	e4	30	260	20 mm
TLK100PHP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	1.1,1.8,3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e4	NOT SPECIFIED	260	7 mm
TLK1521IPAP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TTL				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e4	30	260	10 mm
TRF1020PFB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.2 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm
TRF2443IPFP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified	e4	30	260	12 mm
TRF2443IPFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified	e4	30	260	12 mm
TLK1521PAP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm	Not Qualified				10 mm
TLK1521IPAPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TTL				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e4	30	260	10 mm
TLK2541PFPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified	e4	30	260	12 mm
SN761631PAP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						5 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm	Not Qualified				10 mm
TLK2541PFPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified	e4	30	260	12 mm
SN65LVCP418PAPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	8					3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	4250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e4	30	260	10 mm
TLK2541PFP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					.31 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified	e4	30	260	12 mm
TLK2541PFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified	e4	30	260	12 mm
TLK2521PAP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm	Not Qualified				10 mm
SN65LVCP418PAPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	8					3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	4250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e4	30	260	10 mm
MAX3754CCM-T	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
AD9957BSVZ-REEL13	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HTFQFP	SQUARE	UNSPECIFIED	YES	1						1.8 V	1.8,3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQFP-G48	3	1.2 mm	14 mm	Not Qualified	e3		260	14 mm
MAX3755CCM	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR			.411 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3755CCM+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e3	30	255	7 mm
MAX3755CCM-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3752CCM+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN	QUAD		S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX3754CCM	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR			.362 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	QUAD		S-PQFP-G48		1.2 mm	7 mm	Not Qualified	e0	20	240	7 mm
MAX3752CCM	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3752CCM-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0			7 mm
82V3358EDG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					.464 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3	30	260	10 mm
82V3255EDG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3		260	10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.