TFLGA Other Function Telecom Interface ICs 9

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

ZOE-M8Q-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

51

TFLGA

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B51

3

1.165 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

4.5 mm

ZOE-M8G-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

51

TFLGA

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B51

3

1.165 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

4.5 mm

ADTR1107ACCZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

TFLGA

SQUARE

UNSPECIFIED

YES

1

5 V

GRID ARRAY, THIN PROFILE, FINE PITCH

LCC24,.2SQ,25

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-N24

3

1.13 mm

5 mm

e4

260

5 mm

ADTR1107ACCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

TFLGA

SQUARE

UNSPECIFIED

YES

1

5 V

GRID ARRAY, THIN PROFILE, FINE PITCH

LCC24,.2SQ,25

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-N24

3

1.13 mm

5 mm

e4

260

5 mm

ZOE-M8B-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

51

TFLGA

SQUARE

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B51

3

1.165 mm

4.5 mm

4.5 mm

SE2593A20-R

Skyworks Solutions

TELECOM CIRCUIT

OTHER

BUTT

30

TFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.625 mm

85 Cel

0 Cel

BOTTOM

R-PBGA-B30

1.1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

BCM20736E

Cypress Semiconductor

TELECOM CIRCUIT

INDUSTRIAL

BUTT

48

TFLGA

SQUARE

UNSPECIFIED

YES

1

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B48

1.18 mm

6.5 mm

6.5 mm

SE2547A-R

Skyworks Solutions

TELECOM CIRCUIT

OTHER

BUTT

32

TFLGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B32

1.1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

CYW20736E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

48

TFLGA

SQUARE

UNSPECIFIED

YES

1

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B48

3

1.18 mm

6.5 mm

e1

6.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.