TQFP Other Function Telecom Interface ICs 20

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS2172T/T&R+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
AD73360ASUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G44	3	1.2 mm	10 mm	Not Qualified	e3	30	260	10 mm
AD73360ASU-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G44	3	1.2 mm	10 mm	Not Qualified	e0		240	10 mm
AD73360ASUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G44	3	1.2 mm	10 mm	Not Qualified	e3	30	260	10 mm
AD73360ASU	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G44	3	1.2 mm	10 mm	Not Qualified	e0		240	10 mm
DS21372T+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
DS21372TN	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2172TN+T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
DS21372TN+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
DS2172T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2172TN	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2172T+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
DS2172	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2172T+T&R	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
DS21372	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2172T/T&R	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS21372N	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2172TN+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
DS21372T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2172TN/T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.