COMMERCIAL EXTENDED Other Function Telecom Interface ICs 129

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

ROK104001

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

87

BGA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

3.3 V

GRID ARRAY

75 Cel

0 Cel

BOTTOM

R-XBGA-B87

Not Qualified

PBA31301/2

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

34

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.775 V

GRID ARRAY, LOW PROFILE

1.27 mm

75 Cel

-10 Cel

BOTTOM

R-PBGA-B34

1.6 mm

10.2 mm

Not Qualified

14 mm

PEB3035-P

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.008 mA

5 V

IN-LINE

DIP28(UNSPEC)

Other Telecom ICs

2.54 mm

85 Cel

0 Cel

TIN LEAD

DUAL

R-PDIP-T28

4.6 mm

15.24 mm

Not Qualified

e0

35.9 mm

PBA31301/3S

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

34

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.8 V

GRID ARRAY, LOW PROFILE

1.27 mm

75 Cel

-10 Cel

BOTTOM

R-PBGA-B34

1.6 mm

10.2 mm

Not Qualified

14 mm

BCM4318KFBG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

75 Cel

0 Cel

BOTTOM

S-PBGA-B196

1.4 mm

12 mm

12 mm

BCM4318SKFBG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

75 Cel

0 Cel

BOTTOM

S-PBGA-B144

1.4 mm

10 mm

10 mm

TA31056F-TP2

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

8.5 mA

3 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G8

1.9 mm

4.4 mm

Not Qualified

NOT SPECIFIED

240

5 mm

TA31056F-(EL)

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

8.5 mA

3 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G8

1.9 mm

4.4 mm

Not Qualified

NOT SPECIFIED

240

5 mm

TA31080F-TP2

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TA31056F

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

8.5 mA

3 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G8

1.9 mm

4.4 mm

Not Qualified

NOT SPECIFIED

240

5 mm

TB31301F(EL)

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

20 mA

5 V

FLATPACK

.65 mm

75 Cel

-20 Cel

QUAD

S-PQFP-G64

3.15 mm

12 mm

Not Qualified

12 mm

TA31051N

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

24

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

12 mA

5 V

IN-LINE, SHRINK PITCH

1.778 mm

75 Cel

-20 Cel

DUAL

R-PDIP-T24

4.5 mm

7.62 mm

Not Qualified

22 mm

TA31056P

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

8.5 mA

3 V

IN-LINE

2.54 mm

75 Cel

-25 Cel

DUAL

R-PDIP-T8

4.25 mm

7.62 mm

Not Qualified

NOT SPECIFIED

240

9.6 mm

TA31080F-TP1

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TB31301F-TP2

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

20 mA

5 V

FLATPACK

.65 mm

75 Cel

-20 Cel

QUAD

S-PQFP-G64

3.15 mm

12 mm

Not Qualified

12 mm

TA31080F

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TA31056F-TP1

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

8.5 mA

3 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G8

1.9 mm

4.4 mm

Not Qualified

NOT SPECIFIED

240

5 mm

TB31301F

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

20 mA

5 V

FLATPACK

.65 mm

75 Cel

-20 Cel

QUAD

S-PQFP-G64

3.15 mm

12 mm

Not Qualified

12 mm

TB31301F-TP1

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

20 mA

5 V

FLATPACK

.65 mm

75 Cel

-20 Cel

QUAD

S-PQFP-G64

3.15 mm

12 mm

Not Qualified

12 mm

TA31080N

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

24

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

18 mA

5 V

IN-LINE, SHRINK PITCH

1.778 mm

75 Cel

-25 Cel

DUAL

R-PDIP-T24

4.5 mm

7.62 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

22 mm

TA32032F

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

UPC3228T5S-E2

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

80 Cel

-20 Cel

QUAD

S-PQCC-N32

.85 mm

5 mm

5 mm

UPC8139GR-7JH

Renesas Electronics

COMMERCIAL EXTENDED

GULL WING

30

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

49 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP30,.25,20

Other Telecom ICs

.5 mm

80 Cel

-30 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G30

Not Qualified

e0

RY7011A0000DZ00#002

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BUTT

42

LLGA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

GRID ARRAY, LOW PROFILE

.85 mm

75 Cel

-25 Cel

BOTTOM

R-XBGA-B42

3

1.7 mm

8.95 mm

13.35 mm

PHS6903

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1

-5.2 V

FLATPACK

1.27 mm

80 Cel

-10 Cel

QUAD

S-PQFP-G32

2.85 mm

12 mm

Not Qualified

12 mm

M66335FP

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

.8 mm

75 Cel

-20 Cel

QUAD

R-PQFP-G80

3.05 mm

14 mm

Not Qualified

20 mm

RY7011A0000DZ00#001

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BUTT

42

LLGA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

GRID ARRAY, LOW PROFILE

.85 mm

75 Cel

-25 Cel

BOTTOM

R-XBGA-B42

3

1.7 mm

8.95 mm

13.35 mm

UPC3228T5S-E2-A

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

32

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

80 Cel

-20 Cel

TIN BISMUTH

QUAD

S-PQCC-N32

.85 mm

5 mm

Not Qualified

e6

5 mm

PHS6902

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1

-5.2 V

FLATPACK

1.27 mm

80 Cel

-10 Cel

QUAD

S-PQFP-G32

2.85 mm

12 mm

Not Qualified

12 mm

LG1602BXB

Broadcom

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

LQFP

SQUARE

METAL

YES

1

-5.2 V

FLATPACK, LOW PROFILE

.762 mm

75 Cel

0 Cel

TIN LEAD

QUAD

S-MQFP-G16

1.6256 mm

5.842 mm

Not Qualified

e0

30

240

5.842 mm

LG1602AXB

Broadcom

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

LQFP

SQUARE

METAL

YES

1

-5.2 V

FLATPACK, LOW PROFILE

.762 mm

75 Cel

0 Cel

TIN LEAD

QUAD

S-MQFP-G16

1.6256 mm

5.842 mm

Not Qualified

e0

30

240

5.842 mm

KT8584L

Samsung

TELECOM CIRCUIT

COMMERCIAL EXTENDED

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

1.27 mm

75 Cel

-25 Cel

QUAD

R-PQCC-J32

3.55 mm

11.43 mm

Not Qualified

13.97 mm

KT8583J

Samsung

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

-5 V

5 V

IN-LINE

2.54 mm

75 Cel

-25 Cel

DUAL

R-GDIP-T16

5.08 mm

7.62 mm

Not Qualified

19.495 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.