Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.16 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
85 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.16 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.095 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.085 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
Conexant Systems |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
.1 mA |
5 V |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J68 |
CEPT PCM-30/E-1 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.095 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
Zarlink Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.3 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.506 mm |
Not Qualified |
e0 |
260 |
11.506 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
155 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.085 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.155 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
|||||||||||||||||||||||||||||||
Cypress Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
160 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e0 |
11.5316 mm |
|||||||||||||||||||||||||||||||||||
Cypress Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
160 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.572 mm |
11.5316 mm |
Not Qualified |
e0 |
11.5316 mm |
||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 V |
-4.2/-5.46 |
CHIP CARRIER |
LDCC28,.5SQ |
Network Interfaces |
1.27 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
e0 |
235 |
11.505 mm |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.06 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
3 |
4.57 mm |
16.585 mm |
Not Qualified |
e0 |
16.585 mm |
||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.06 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
3 |
4.57 mm |
16.585 mm |
Not Qualified |
e3 |
245 |
16.585 mm |
||||||||||||||||||||||||||||||||||
Cypress Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
95 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e0 |
11.5316 mm |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.572 mm |
11.5316 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
11.5316 mm |
|||||||||||||||||||||||||||||||||||||||
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
85 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
3 |
4.57 mm |
11.53 mm |
Not Qualified |
e0 |
11.53 mm |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
11.505 mm |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
220 mA |
5 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
11.505 mm |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
220 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J44 |
T-3(DS3) |
STS-1/OC-1 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5.2 V |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
2A |
4.57 mm |
11.43 mm |
e0 |
245 |
11.43 mm |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
11.505 mm |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5.2 V |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.43 mm |
11.43 mm |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
11.505 mm |
||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
MILITARY |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
-5.2 V |
.054 mA |
5 V |
5,-5.2 |
CHIP CARRIER |
LDCC68,1.0SQ |
Other Telecom ICs |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-CQCC-J68 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
-5.2 V |
.054 mA |
5 V |
5,-5.2 |
CHIP CARRIER |
LDCC68,1.0SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-CQCC-J68 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
T-1(DS1) |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J44 |
CEPT PCM-30/E-1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J44 |
CEPT PCM-30/E-1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.1808 mm |
Not Qualified |
24.1808 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
4.572 mm |
12.446 mm |
Not Qualified |
12.446 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.1808 mm |
Not Qualified |
24.1808 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 V |
-4.2/-5.46 |
CHIP CARRIER |
LDCC28,.5SQ |
Network Interfaces |
1.27 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
e0 |
11.505 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
80 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
80 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.1808 mm |
Not Qualified |
24.1808 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.1808 mm |
Not Qualified |
24.1808 mm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
-5 V |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J52 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
BIPOLAR |
-5 V |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
10 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J44 |
T-1(DS1) |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
-5 V |
85 mA |
5 V |
2-4 CONVERSION |
+-5 |
CHIP CARRIER |
LDCC44,.7SQ |
Analog Transmission Interfaces |
1.27 mm |
70 Cel |
-48 TO 72 |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
CONSTANT CURRENT/RESISTIVE |
e0 |
16.5862 mm |
||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
e0 |
16.5862 mm |
||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.