THROUGH-HOLE Other Function Telecom Interface ICs 320

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RN42XVP-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,20LEAD(UNSPEC)		2 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL	.3 Mbps	R-XDMA-T20				24.4 mm		e4			29.9 mm
RN41XVC-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-T20	1	2 mm		24.4 mm					29.9 mm
RN42XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm		24.4 mm		e4			29.9 mm
XB3-24Z8PT-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20							NOT SPECIFIED	NOT SPECIFIED
RN41XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm		24.4 mm		e4			29.9 mm
XB3-24Z8UT-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20							NOT SPECIFIED	NOT SPECIFIED
XB3-24Z8ST-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20							NOT SPECIFIED	NOT SPECIFIED
XB3-24Z8PT	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20
XB3-24Z8ST	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20
XB3-24Z8UT	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20
ISO508P	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T24		6.35 mm		15.24 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	30.99 mm
SA602AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm		7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.5 mm
SA612AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm		7.62 mm	Not Qualified		40	250	9.5 mm
SA612AN,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm		7.62 mm	Not Qualified		40	250	9.5 mm
HT12D(18DIP)	Holtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					2.4/12	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	-20 Cel		DUAL		R-PDIP-T18					Not Qualified
MCP2120-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	TS 16949		.016 mA	5 V	3/5	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T14		5.334 mm		7.62 mm	Not Qualified	e3			19.05 mm
SA612AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T8		4.2 mm		7.62 mm	Not Qualified	e4			9.5 mm
CYG2030	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		HYBRID			9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18					Not Qualified
AD630JN/+	Analog Devices		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		-15 V	.005 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20						e0
MCP2140A-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	TS 16949			3 V		IN-LINE	DIP18,.3		2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T18		5.334 mm		7.62 mm	Not Qualified	e3			22.86 mm
CYG2031	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		HYBRID			9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18					Not Qualified
CYG2021	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		HYBRID			9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18					Not Qualified
DNT24CA	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	30		RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-T30				24.9 mm					38.1 mm
AD630KN/+	Analog Devices		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		-15 V	.005 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20						e0
AD630BD/+	Analog Devices		OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC	NO		BIPOLAR		-15 V	5 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T20						e0
XB24CASIT-001	Digi International	TELECOM CIRCUIT		THROUGH-HOLE	20	XMA	UNSPECIFIED	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	X-XXMA-T20				24.38 mm					27.61 mm
XR2211ACP-F	Exar	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			.009 mA	12 V	12	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDIP-T14		5.33 mm		7.62 mm	Not Qualified	e3			19.305 mm
AN7580	Panasonic	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	12	SIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR				12 V		IN-LINE				75 Cel	-25 Cel		SINGLE		R-PSIP-T12					Not Qualified
HC1-55536-5	Intersil		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	CERAMIC	NO		CMOS			1.5 mA	5 V	5	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T14					Not Qualified	e0
UA796PC	Fairchild Semiconductor		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					12,-8	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T14					Not Qualified	e0
TCM2912B-3J	Texas Instruments		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		MOS		-5 V		5 V	+-5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-XDIP-T16			T-1(DS1)		Not Qualified
UCC3751N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS				12 V	12	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16		5.08 mm		7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19.305 mm
TNETA1622DWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				107 mA	5 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T20					Not Qualified
LM2893N	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR				18 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T20		5.08 mm		7.62 mm					26.07 mm
TL852CNE4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR				5 V		IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	40 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16	1	5.08 mm		7.62 mm	Not Qualified	e4			19.305 mm
TCM2912CJ-00	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			-5 V	15 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-GDIP-T16		5.08 mm		7.62 mm	Not Qualified				19.6 mm
UCC5341N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS				3.3 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T8		5.33 mm		7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.78 mm
RI-STU-MRD1	Texas Instruments	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	30		RECTANGULAR	UNSPECIFIED	NO	1					5 V		MICROELECTRONIC ASSEMBLY				50 Cel	-20 Cel		DUAL		R-XDMA-T30					Not Qualified
SN74LS462N	Texas Instruments		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		TTL						IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T20					Not Qualified
TMP70A2400NL	Texas Instruments		COMMERCIAL	THROUGH-HOLE		DIP		PLASTIC/EPOXY	NO		CMOS				5 V	5	IN-LINE	DIP(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL							Not Qualified
TMS70A2400ANL	Texas Instruments		COMMERCIAL	THROUGH-HOLE		DIP		PLASTIC/EPOXY	NO		CMOS				5 V	5	IN-LINE	DIP(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL							Not Qualified
TCM4207AJ	Texas Instruments		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC	NO		CMOS		-5 V		5 V	+-5	IN-LINE	DIP24,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-XDIP-T24					Not Qualified
UCC3750N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS				5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T28		5.08 mm		15.24 mm	Not Qualified	e4			36.32 mm
TCM2912C-3J	Texas Instruments		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		MOS		-5 V		5 V	+-5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-XDIP-T16			T-1(DS1)		Not Qualified
UCC3751NG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS				12 V	12	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16		5.08 mm		7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19.305 mm
UCC5343N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS				3.3 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16		6.6 mm		7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19.3 mm
UCC5342N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS				3.3 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T14		5.33 mm		7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19.3 mm
TCM2912CJ	Texas Instruments		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		MOS		-5 V		5 V	+-5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-XDIP-T16			T-1(DS1)		Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.