Diodes Incorporated Other Function Telecom Interface ICs 81

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AP3860FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40		.8 mm	5 mm				260	5 mm
CS5519AJI3FN-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
AP3890FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel		QUAD	S-XQCC-N56		.8 mm	7 mm					7 mm
CS5519AJI1FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
CS5519CJI1FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	7 mm		e3	30	260	7 mm
PI5USB8000QZHEX	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	3 mm					3 mm
PI3USBH22ZLE	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	2.5 mm					2.5 mm
PI3EQX7701	Diodes Incorporated
AP3891FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
PI3USB30532ZLE	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N40		.8 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
PT8A9792P	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		3 V	3	IN-LINE	DIP16(UNSPEC)	Other Telecom ICs		55 Cel	-10 Cel		DUAL	R-PDIP-T16				Not Qualified
AP3892FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel		QUAD	S-XQCC-N68		.8 mm	8 mm					8 mm
PT8A991AP	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		4 V	4	IN-LINE	DIP24(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL	R-PDIP-T24				Not Qualified
CS5519AJI2FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
PT8A986S	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				5 V	5	SMALL OUTLINE	SOP24(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL	R-PDSO-G24				Not Qualified
CS5519AJI2FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
PI5USB8000QZHE	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	3 mm					3 mm
AP3861FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	6 mm				260	6 mm
PI3EQX1004B1ZHEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	42	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD	R-XQCC-N42		.84 mm	3.5 mm					9 mm
WN6612LH-L5	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	NO	1	CMOS		3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel		ZIG-ZAG	R-XZMA-N52			26.8 mm			NOT SPECIFIED	NOT SPECIFIED	30 mm
PI2EQX4401DZFE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-XQCC-N36	1	.8 mm	5 mm	Not Qualified	e3			6 mm
PI2EQX6804-A	Diodes Incorporated
PI2EQX4401DZFEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-XQCC-N36	1	.8 mm	5 mm	Not Qualified	e3			6 mm
PI2EQX4402DNBEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	BALL	84	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B84	3	1.46 mm	9 mm	Not Qualified	e1			9 mm
PI2EQX4432DZDE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N48		.84 mm	7 mm	Not Qualified	e3			7 mm
PI2EQX4432DZDEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N48		.84 mm	7 mm	Not Qualified	e3			7 mm
PI2EQX4410	Diodes Incorporated
PI2EQX4401	Diodes Incorporated
PI2EQX5864	Diodes Incorporated
PI2EQX4402	Diodes Incorporated
AP22811AM8-13	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8		1.1 mm	2.95 mm		e3	30	260	3 mm
AP22811BM8-13	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8		1.1 mm	2.95 mm		e3	30	260	3 mm
AP22804AM8-13	Diodes Incorporated	TELECOM CIRCUIT		GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8		1.1 mm	3 mm		e3	30	260	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.