Renesas Electronics Other Function Telecom Interface ICs 686

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

80HCPS1616HR

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B400

3.34 mm

21 mm

21 mm

80HCPS1848BRI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B784

3.44 mm

29 mm

29 mm

80HCPS1432RMI

Renesas Electronics

TELECOM CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

4

e1

NOT SPECIFIED

245

80HCPS1616CHMG

Renesas Electronics

TELECOM CIRCUIT

TIN SILVER COPPER

4

245

80HCPS1616RM

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

245

21 mm

80HCPS1432CHMG

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B576

4

2.83 mm

25 mm

e1

NOT SPECIFIED

245

25 mm

80HCPS1616CHR

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

3.34 mm

21 mm

Not Qualified

e1

245

21 mm

80HCPS1848CBR

Renesas Electronics

TELECOM CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

4

e1

NOT SPECIFIED

245

80HCPS1848HM

Renesas Electronics

TELECOM CIRCUIT

Tin/Lead (Sn/Pb)

4

e0

NOT SPECIFIED

225

80HCPS1848CHM

Renesas Electronics

TELECOM CIRCUIT

Tin/Lead (Sn/Pb)

4

e0

NOT SPECIFIED

225

80HCPS1848RMI

Renesas Electronics

TELECOM CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

4

e1

NOT SPECIFIED

250

80HCPS1848RM

Renesas Electronics

TELECOM CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

4

e1

NOT SPECIFIED

250

80HCPS1848CRM

Renesas Electronics

TELECOM CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

4

e1

NOT SPECIFIED

250

80HCPS1848CBRI

Renesas Electronics

TELECOM CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

4

e1

NOT SPECIFIED

245

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.