Texas Instruments Other Function Telecom Interface ICs 1,050

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TSC2000IPW	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	30	260	6.5 mm
BQ51013ARHLT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.002 Mbps	R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4.5 mm
OPA2380AIDGKT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2			.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
TSC2000IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	30	260	6.5 mm
OPA2380AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2			.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
TSC2000IPWRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	NOT SPECIFIED	260	6.5 mm
WL1835MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
CC2640R2FTWRGZTQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	MATTE TIN	QUAD	1 Mbps	S-PQCC-N48	3	1 mm	7 mm			e3	30	260	7 mm
CC2564MODACMOG	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel		-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N35	3		7 mm			e3			14 mm
CC2640R2FYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B34	1	.575 mm	2.684 mm			e1	30	260	2.684 mm
SN65DSI86IPAPQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	10 mm			e4	30	260	10 mm
TSC2000IPWG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	NOT SPECIFIED	260	6.5 mm
SN65DSI86IPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	10 mm			e4	30	260	10 mm
CC1200RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
CC1125RHMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	.9 mm	5 mm	Not Qualified		e4	30	260	5 mm
CC2500RGPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.25 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
WL1801MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
OPA380AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1	CMOS		.0088 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
WL1835MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
XCC3235MODSF12MOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	63	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD		R-PQCC-N63		2.45 mm	17.5 mm						20.5 mm
CC2530F256RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
OPA380AIDG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
XWL1837MODGIMOC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V		GRID ARRAY			.7 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm						13.4 mm
BQ51013BYFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
CC430F6137IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64	3	1 mm	9 mm	Not Qualified		e4	30	260	9 mm
BQ51003YFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
OPA380AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1			.008 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
SN65DSI83ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
CC2541F256TRHATQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2 Mbps	S-PQCC-N40	3	1 mm	6 mm			e4	30	260	6 mm
AFE031AIRGZT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1			.0053 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	NOT SPECIFIED	260	7 mm
CC2564CRVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD	4 Mbps	S-XQCC-N76	3	.9 mm	8 mm			e3	30	260	8 mm
SN65DSI85TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm			e4	30	260	10 mm
CC2564BRVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		R-PQCC-N76	3	.9 mm	7.73 mm			e3	30	260	8 mm
OPA2380AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2			.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
CC2640R2FYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B34	1	.575 mm	2.684 mm			e1	30	260	2.684 mm
TRF7970ARHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	110 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.848 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
OPA2380AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2				.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
ISO508P	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					5 V		IN-LINE			2.54 mm	85 Cel		-40 Cel		DUAL		R-PDIP-T24		6.35 mm	15.24 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	30.99 mm
CC1175RHMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	.9 mm	5 mm	Not Qualified		e4	30	260	5 mm
CC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel		-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm			e3			7 mm
CC2564BYFVR-XI	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm	2.93 mm			e1	30	260	3.26 mm
CC430F5135IRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel		-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm			e3			7 mm
TUSB211RWBR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1			.02 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
CC2564CRVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD	4 Mbps	S-XQCC-N76	3	.9 mm	8 mm			e3	30	260	8 mm
CC2640F128RSMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	3	1 mm	4 mm			e4	NOT SPECIFIED	260	4 mm
WL1805MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
CC2640F128RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	3	1 mm	5 mm			e4	NOT SPECIFIED	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.