Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Mitel Semiconductor |
DTMF SIGNALING CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
11 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Telecom Signaling Circuits |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
|||||||||
|
Microchip Technology |
DTMF SIGNALING CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
10 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Telecom Signaling Circuits |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
12.8 mm |
|||||
California Micro Devices |
DTMF SIGNALING CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
Telecom Signaling Circuits |
.65 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
6.5 mm |
||||||||
Microsemi |
DTMF SIGNALING CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
5.5 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Telecom Signaling Circuits |
.635 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
Not Qualified |
||||||||||||
|
Microchip Technology |
DTMF SIGNALING CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5.5 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Telecom Signaling Circuits |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
7.2 mm |
|||||
|
Microchip Technology |
DTMF SIGNALING CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5.5 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Telecom Signaling Circuits |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
7.2 mm |
|||||
NXP Semiconductors |
DTMF SIGNALING CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
SMALL OUTLINE |
SOP20,.3 |
Telecom Signaling Circuits |
1.27 mm |
70 Cel |
-20 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
2 mm |
5.25 mm |
Not Qualified |
e0 |
12.675 mm |
|||||||
Toshiba |
DTMF SIGNALING CIRCUIT |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
SMALL OUTLINE |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1.8 mm |
5.3 mm |
Not Qualified |
e0 |
12.8 mm |
||||||||||||||
Toshiba |
DTMF SIGNALING CIRCUIT |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
SMALL OUTLINE |
1.27 mm |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
1.8 mm |
5.3 mm |
Not Qualified |
e0 |
12.8 mm |
||||||||||||||
Toshiba |
DTMF SIGNALING CIRCUIT |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
SMALL OUTLINE |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1.8 mm |
5.3 mm |
Not Qualified |
e0 |
12.8 mm |
||||||||||||||
Renesas Electronics |
TONE DECODER CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-20 Cel |
DUAL |
R-PDSO-G20 |
2.2 mm |
5.5 mm |
Not Qualified |
12.6 mm |
|||||||||||||
Samsung |
DTMF SIGNALING CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.009 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Telecom Signaling Circuits |
1.27 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
12.8 mm |
Telecom Signaling ICs are electronic components used in telecommunications systems to encode and decode signaling messages used to control and manage the network. These ICs are designed to provide reliable and efficient signaling capabilities, allowing for the efficient operation and management of telecommunication systems.
Telecom Signaling ICs are responsible for generating and interpreting signaling messages, which are used to control call setup, routing, and network management functions. They use various signaling protocols, such as Signaling System 7 (SS7), to encode and decode these messages.
Some common features of Telecom Signaling ICs include:
1. Signaling protocol support: Signaling ICs support various signaling protocols, allowing them to be used in a wide range of telecommunication systems.
2. Signal processing: Signaling ICs are designed to process signals quickly and efficiently, ensuring fast and reliable communication.
3. Error detection and correction: Signaling ICs use error detection and correction techniques to ensure that signaling messages are transmitted and received correctly.
4. Compatibility: Signaling ICs are designed to be compatible with various telecommunication systems, allowing them to be easily integrated into existing networks.
Telecom Signaling ICs are used in a variety of telecommunications systems, including voice and data networks, cellular networks, and IP-based networks. They are also used in network management systems, allowing for the efficient control and management of network resources.