Toshiba Telecom - Signaling ICs 10

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Length
TC35305F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G14	1.9 mm	5.3 mm	Not Qualified	e0	10.3 mm
TC35302P	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE						TIN LEAD	DUAL	R-PDIP-T18			Not Qualified	e0
TC35307P	Toshiba	TONE DECODER CIRCUIT		THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T8	3.8 mm	7.62 mm	Not Qualified	e0	9.66 mm
TC35300BP	Toshiba	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS	.007 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T18			Not Qualified	e0
TC35306P	Toshiba	TONE DECODER CIRCUIT		THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T8	3.8 mm	7.62 mm	Not Qualified	e0	9.66 mm
TC35301BP	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE						TIN LEAD	DUAL	R-PDIP-T18			Not Qualified	e0
TC35305P	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T14		7.62 mm	Not Qualified	e0	19.25 mm
TC35311F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G20	1.8 mm	5.3 mm	Not Qualified	e0	12.8 mm
TC35310F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20	1.8 mm	5.3 mm	Not Qualified	e0	12.8 mm
TC35302F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G20	1.8 mm	5.3 mm	Not Qualified	e0	12.8 mm

Telecom - Signaling ICs

Telecom Signaling ICs are electronic components used in telecommunications systems to encode and decode signaling messages used to control and manage the network. These ICs are designed to provide reliable and efficient signaling capabilities, allowing for the efficient operation and management of telecommunication systems.

Telecom Signaling ICs are responsible for generating and interpreting signaling messages, which are used to control call setup, routing, and network management functions. They use various signaling protocols, such as Signaling System 7 (SS7), to encode and decode these messages.

Some common features of Telecom Signaling ICs include:

1. Signaling protocol support: Signaling ICs support various signaling protocols, allowing them to be used in a wide range of telecommunication systems.

2. Signal processing: Signaling ICs are designed to process signals quickly and efficiently, ensuring fast and reliable communication.

3. Error detection and correction: Signaling ICs use error detection and correction techniques to ensure that signaling messages are transmitted and received correctly.

4. Compatibility: Signaling ICs are designed to be compatible with various telecommunication systems, allowing them to be easily integrated into existing networks.

Telecom Signaling ICs are used in a variety of telecommunications systems, including voice and data networks, cellular networks, and IP-based networks. They are also used in network management systems, allowing for the efficient control and management of network resources.