208 Telecom - Switching ICs 14

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
IDT72V71660BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e1			17 mm
IDT72V73263BB	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e0	30	225	17 mm
72V73273BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.38 mA	3.3 V	3.3	GRID ARRAY	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e1	30	260	17 mm
72V73263BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e1		260	17 mm
72V73273BB	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.38 mA	3.3 V	3.3	GRID ARRAY	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e0	30	225	17 mm
72V73263BB	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.38 mA	3.3 V	3.3	GRID ARRAY	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e0	30	225	17 mm
IDT72V71660DRG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	e3			28 mm
IDT72V73273DRG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	e3			28 mm
IDT72V71660DRG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	e3			28 mm
IDT72V73263DRG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	e3			28 mm
IDT72V73263BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e1			17 mm
IDT72V73273BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e1			17 mm
IDT72V73263DRG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	e3			28 mm
IDT72V73273DRG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	e3			28 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.