256 Telecom - Switching ICs 7

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Peak Reflow Temperature (C)	Length
VSC7514XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm					17 mm
ZL50020QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		120 mA	1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G256		1.6 mm	28 mm	Not Qualified		e3		28 mm
ZL50022QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		175 mA	1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G256		1.6 mm	28 mm	Not Qualified		e3		28 mm
ZL50023QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		130 mA	1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G256		1.6 mm	28 mm					28 mm
VSC7513XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm					17 mm
SJA1110BEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	ISO 26262; AEC-Q100		1.8 V		GRID ARRAY							BOTTOM	R-PBGA-B256	3				ALSO OPERATES WITH NOMINAL 2.5V AND 3.3V SUPPLY		260
SJA1110CEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100; ISO 26262		1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32		.8 mm				BOTTOM	S-PBGA-B256	3	1.5 mm	14 mm		ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY		260	14 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.