HLFQFP Telecom - Switching ICs 3
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET SWITCH |
INDUSTRIAL |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
e3 |
10 mm |
||||||||||
|
Tttech Flexibilis Oy |
ETHERNET SWITCH |
NO LEAD |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
QUAD |
S-PQFP-G144 |
1.65 mm |
20 mm |
20 mm |
|||||||||||||||
|
|
Microchip Technology |
ETHERNET SWITCH |
INDUSTRIAL |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
115 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
e3 |
10 mm |
Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.
Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.
TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.
Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.
Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.