HTFQFP Telecom - Switching ICs 32

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

KSZ9477STXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ9477STXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ9896CTXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ9896CTXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ9567STXI

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

KSZ9896CTXC

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ9567RTXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

KSZ8567RTXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

KSZ9896CTXC-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ8567RTXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

LAN9353I/PT

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PQFP64,.48SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.2 mm

10 mm

e3

10 mm

KSZ9567RTXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

KSZ9567STXI-TR

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

LAN9355I/PT

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G80

1.2 mm

12 mm

e3

12 mm

KSZ8567STXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G128

1.2 mm

14 mm

14 mm

KSZ8567STXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G128

1.2 mm

14 mm

14 mm

KSZ8567STXV-VAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G128

1.2 mm

14 mm

14 mm

KSZ8567STXV-TRVAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G128

1.2 mm

14 mm

14 mm

KSZ8567RTXVVAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G128

1.2 mm

14 mm

30

260

14 mm

KSZ8567RTXV-TRVAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G128

1.2 mm

14 mm

30

260

14 mm

LAN9353/PT

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PQFP64,.48SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.2 mm

10 mm

e3

10 mm

KSZ8565RTXV-VAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G128

1.2 mm

14 mm

30

260

14 mm

VSC7422XJQ-04

Microchip Technology

ETHERNET SWITCH

AUTOMOTIVE

GULL WING

302

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.6 mA

1 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP302,.1SQ

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G302

1.2 mm

24 mm

24 mm

LAN9312-NZW

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

295 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

HQFP128,.63SQ,16

Network Interfaces

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

Not Qualified

e3

14 mm

LAN9353T/PT

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PQFP64,.48SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.2 mm

10 mm

e3

10 mm

KSZ8565RTXV-TRVAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G128

1.2 mm

14 mm

30

260

14 mm

LAN9355/PT

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G80

1.2 mm

12 mm

NOT SPECIFIED

NOT SPECIFIED

12 mm

LAN9353TI/PT

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PQFP64,.48SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.2 mm

10 mm

e3

10 mm

LAN9311I-NZW

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

295 mA

3.3 V

3.3/3.6

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

Network Interfaces

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

Not Qualified

e3

14 mm

LAN9352/PT

Microchip Technology

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G80

1.2 mm

12 mm

12 mm

LAN9352I/PT

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G80

1.2 mm

12 mm

12 mm

LAN9352T/PT

Microchip Technology

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G80

1.2 mm

12 mm

12 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.