SQUARE Telecom - Switching ICs 308

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SJA1105REL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SJA1105SEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
VSC7424XJG-02	Microchip Technology	ETHERNET SWITCH		BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm						27 mm
VSC7428XJG-12	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7448YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			7600 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
72V73273BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.38 mA	3.3 V	3.3	GRID ARRAY	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified		e1	30	260	17 mm
LAN9311I-NZW	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	295 mA	3.3 V	3.3/3.6	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	Network Interfaces	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm	Not Qualified		e3			14 mm
ZL50012QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	160	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			250 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP160,1.0SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G160		1.6 mm	24 mm	Not Qualified		e3			24 mm
72V73263BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified		e1		260	17 mm
IDT72V90823PFG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified		e3			14 mm
LAN9352/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm						12 mm
LAN9352I/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm						12 mm
LAN9352T/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm						12 mm
LAN9352TI/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N72		1 mm	10 mm						10 mm
VSC7421XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7546TSN-V/5CC-VAO	Microchip Technology	ETHERNET SWITCH		BALL	888	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		.9 V		GRID ARRAY, FINE PITCH	BGA888,30X30,32		.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B888		2.806 mm	24.6 mm						24.6 mm
VSC7513XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM53125B0MKMMLG	Broadcom	ETHERNET SWITCH		UNSPECIFIED	186		SQUARE	UNSPECIFIED		1													UNSPECIFIED	S-XXSS-X	3							260
BCM53115MKPBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY	BGA484,22X22,40		1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B484		2.43 mm	23 mm						23 mm
BCM88690CB1KFSBG	Broadcom	ETHERNET SWITCH		BALL	4344	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY	BGA4344,66X66,40		1 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	S-PBGA-B4344		5.64 mm	67.5 mm			e1			67.5 mm
KSZ8462FHLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8852HLEYA	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	115 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8895MLXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm			e3			14 mm
VSC7420XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7427XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7436XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V		GRID ARRAY	BGA324,18X18,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm						19 mm
VSC7449YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			8100 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
VSC7468YIH-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			8600 mA	1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
AD8150AST	Analog Devices	DIGITAL TIME SWITCH	OTHER	GULL WING	184	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			.45 mA	3.3 V	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP184,.87SQ,16	Other Telecom ICs	.4 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G184	3	1.6 mm	20 mm	Not Qualified		e0		240	20 mm
AD8150ASTZ	Analog Devices	DIGITAL TIME SWITCH	OTHER	GULL WING	184	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			.45 mA	3.3 V	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP184,.87SQ,16	Other Telecom ICs	.4 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G184	3	1.6 mm	20 mm	Not Qualified		e3		260	20 mm
M3488Q1	STMicroelectronics	DIGITAL TIME SWITCH	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		30 mA	5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G44		2.45 mm	10 mm	Not Qualified		e4			10 mm
SC2000	NXP Semiconductors	DIGITAL TIME SWITCH	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD	S-PQCC-J68		4.57 mm	25.146 mm	Not Qualified					25.146 mm
SJA1105PEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SJA1105QEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SC4000	NXP Semiconductors	DIGITAL TIME SWITCH	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified					14 mm
SJA1110CEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262		1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32		.8 mm				BOTTOM	S-PBGA-B256	3	1.5 mm	14 mm		ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY			260	14 mm
PEB2047-N	Infineon Technologies	DIGITAL TIME SWITCH	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.02 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.57 mm	16.6 mm	Not Qualified		e0			16.6 mm
PEF2046-N	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.01 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44		4.57 mm	16.6 mm	Not Qualified		e0			16.6 mm
PEF24471HTSI-XL	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.25 mA	3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified		e0			23 mm
PEF20451	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified					23 mm
PEB2045-N	Infineon Technologies	DIGITAL TIME SWITCH	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.01 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.57 mm	16.6 mm	Not Qualified		e0			16.6 mm
PEF20471HTSI-L	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.25 mA	3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified		e0			23 mm
PEB2046-N	Infineon Technologies	DIGITAL TIME SWITCH	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.01 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44		4.57 mm	16.6 mm	Not Qualified		e0			16.6 mm
PEB2245	Infineon Technologies	CONFERENCING CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.02 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.57 mm	16.6 mm	Not Qualified		e0			16.6 mm
PEB2445NV1.2	Infineon Technologies	CONFERENCING CIRCUIT	COMMERCIAL	J BEND	44		SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER				70 Cel	0 Cel		QUAD	S-PQCC-J44				Not Qualified
PEF24471	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified					23 mm
PEB2047-16-N	Infineon Technologies	DIGITAL TIME SWITCH		J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER			1.27 mm				QUAD	S-PQCC-J44		4.57 mm	16.6 mm	Not Qualified					16.6 mm
PEF20471	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified					23 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.