Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
15 mA |
5 V |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.23 mm |
Not Qualified |
e3 |
24.23 mm |
||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
TIN SILVER COPPER |
3 |
e1 |
260 |
||||||||||||||||||||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
20 mm |
||||||||||
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
160 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
250 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP160,1.0SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G160 |
1.6 mm |
24 mm |
Not Qualified |
e0 |
24 mm |
||||||||
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
200 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B272 |
3 |
2.32 mm |
27 mm |
Not Qualified |
e1 |
27 mm |
|||||
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
256 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
120 mA |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
Other Telecom ICs |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G256 |
1.6 mm |
28 mm |
Not Qualified |
e3 |
28 mm |
|||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
40 |
260 |
14 mm |
||||||||
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
256 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
175 mA |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
Other Telecom ICs |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G256 |
1.6 mm |
28 mm |
Not Qualified |
e3 |
28 mm |
|||||||
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
256 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
130 mA |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G256 |
1.6 mm |
28 mm |
28 mm |
||||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.01 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
14 mm |
|||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B208 |
3 |
1.97 mm |
17 mm |
Not Qualified |
e1 |
17 mm |
||||||||||
|
Microsemi |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
15 mA |
5 V |
5 |
FLATPACK |
QFP64,.7X.95,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G64 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
14 mm |
||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
14 mm |
||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
40 |
260 |
14 mm |
||||||||
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B208 |
3 |
1.97 mm |
17 mm |
Not Qualified |
e0 |
30 |
225 |
17 mm |
|||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
TIN SILVER COPPER |
3 |
e1 |
260 |
||||||||||||||||||||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.38 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA208,16X16,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B208 |
3 |
1.97 mm |
17 mm |
Not Qualified |
e1 |
30 |
260 |
17 mm |
||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.045 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.7X.9 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
260 |
20 mm |
|||||
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
160 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
250 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP160,1.0SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G160 |
1.6 mm |
24 mm |
Not Qualified |
e3 |
24 mm |
|||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B208 |
3 |
1.97 mm |
17 mm |
Not Qualified |
e1 |
260 |
17 mm |
|||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||
Analog Devices |
DIGITAL TIME SWITCH |
OTHER |
GULL WING |
184 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.45 mA |
3.3 V |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP184,.87SQ,16 |
Other Telecom ICs |
.4 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G184 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e0 |
240 |
20 mm |
||||||
|
Analog Devices |
DIGITAL TIME SWITCH |
OTHER |
GULL WING |
184 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.45 mA |
3.3 V |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP184,.87SQ,16 |
Other Telecom ICs |
.4 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G184 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
260 |
20 mm |
|||||
|
STMicroelectronics |
DIGITAL TIME SWITCH |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
30 mA |
5 V |
5 |
IN-LINE |
DIP40,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T40 |
15.24 mm |
Not Qualified |
e3 |
52.07 mm |
|||||||
|
STMicroelectronics |
DIGITAL TIME SWITCH |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
30 mA |
5 V |
5 |
FLATPACK |
QFP44,.5SQ,32 |
Other Telecom ICs |
.8 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
2.45 mm |
10 mm |
Not Qualified |
e4 |
10 mm |
||||||
NXP Semiconductors |
DIGITAL TIME SWITCH |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
25.146 mm |
Not Qualified |
25.146 mm |
|||||||||||||
NXP Semiconductors |
DIGITAL TIME SWITCH |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
14 mm |
|||||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.02 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.6 mm |
Not Qualified |
e0 |
16.6 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.01 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.6 mm |
Not Qualified |
e0 |
16.6 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.25 mA |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
e0 |
23 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
23 mm |
||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.2 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.7X.9 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.01 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.6 mm |
Not Qualified |
e0 |
16.6 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.2 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.7X.9 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.25 mA |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
e0 |
23 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.01 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.6 mm |
Not Qualified |
e0 |
16.6 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.1 mA |
5 V |
5 |
FLATPACK |
QFP100,.7X.9 |
Other Telecom ICs |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
e0 |
20 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
23 mm |
||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.6 mm |
Not Qualified |
16.6 mm |
|||||||||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
.01 mA |
5 V |
5 |
IN-LINE |
DIP40,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T40 |
5.1 mm |
15.24 mm |
Not Qualified |
e0 |
50.9 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
23 mm |
||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.6 mm |
Not Qualified |
16.6 mm |
|||||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
.01 mA |
5 V |
5 |
IN-LINE |
DIP40,.6 |
Other Telecom ICs |
2.54 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T40 |
5.1 mm |
15.24 mm |
Not Qualified |
e0 |
50.9 mm |
Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.
Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.
TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.
Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.
Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.