ETHERNET TRANSCEIVER Telecom - Switching ICs 16

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
KSZ9567STXI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128	3	1.2 mm	14 mm	e3		260	14 mm
LAN9353I/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm	e3			10 mm
KSZ9567STXI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128	3	1.2 mm	14 mm	e3		260	14 mm
LAN9353I/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	e3	40	260	9 mm
LAN9353/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	e3	40	260	9 mm
LAN9353/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm	e3			10 mm
LAN9353TI/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	e3	40	260	9 mm
LAN9353T/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm	e3			10 mm
LAN9353TI/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm	e3			10 mm
LAN9352/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm				12 mm
LAN9352I/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm				12 mm
LAN9352T/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm				12 mm
LAN9352TI/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N72		1 mm	10 mm				10 mm
BCM53115MKPBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY	BGA484,22X22,40	1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B484		2.43 mm	23 mm				23 mm
BCM53115MKPB	Broadcom	ETHERNET TRANSCEIVER		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY	BGA484,22X22,40	1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B484		2.43 mm	23 mm				23 mm
BCM53115MIPB	Broadcom	ETHERNET TRANSCEIVER		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY	BGA484,22X22,40	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B484		2.43 mm	23 mm				23 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.