AUTOMOTIVE Telecom - Switching ICs 15

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	JESD-609 Code	Length
VSC7512XMY	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	NO LEAD	172	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1600 mA	1 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC172,.52SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N172	.9 mm	13 mm		13 mm
VSC7511XMY	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	NO LEAD	172	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1600 mA	1 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC172,.52SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N172	.9 mm	13 mm		13 mm
VSC7429XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	2700 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B672	2.44 mm	27 mm	e1	27 mm
VSC7420XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1	2 mA	1 V	GRID ARRAY	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672	2.44 mm	27 mm		27 mm
VSC7428XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	2100 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672	2.44 mm	27 mm		27 mm
VSC7422XJQ-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	GULL WING	302	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	2.6 mA	1 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP302,.1SQ	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G302	1.2 mm	24 mm		24 mm
VSC7423XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	2000 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672	2.36 mm	27 mm		27 mm
VSC7514XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	1800 mA	1 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256	1.8 mm	17 mm		17 mm
VSC7440XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	3300 mA	1 V	GRID ARRAY	BGA324,18X18,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324	1.8 mm	19 mm		19 mm
VSC7422XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1	2.6 mA	1 V	GRID ARRAY	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672	2.44 mm	27 mm		27 mm
VSC7428XJG-12	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	2100 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672	2.44 mm	27 mm		27 mm
VSC7421XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1	2.6 mA	1 V	GRID ARRAY	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672	2.44 mm	27 mm		27 mm
VSC7513XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	1800 mA	1 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256	1.8 mm	17 mm		17 mm
VSC7436XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	3300 mA	1 V	GRID ARRAY	BGA324,18X18,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324	1.8 mm	19 mm		19 mm
VSC7468YIH-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1	8600 mA	1 V	GRID ARRAY		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672	2.71 mm	27 mm		27 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.