COMMERCIAL Telecom - Switching ICs 78

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
KSZ8863RLL	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm	7 mm			e3			7 mm
KSZ8863MLL	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm	7 mm			e3			7 mm
KSZ8995XA	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	TIN	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ9893RNXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-N64		.9 mm	8 mm			e3			8 mm
KSZ8795CLXCC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.47SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	10 mm			e3	30	260	10 mm
KSZ8995MA	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		230 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3	30	260	20 mm
KSZ8895MQXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8863RLL-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
LAN9303-ABZJ	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N56		1 mm	8 mm	Not Qualified		e3			8 mm
KSZ8895RQXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3	30	260	20 mm
KSZ8794CNXCC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel		QUAD	S-XQCC-N64		.9 mm	8 mm						8 mm
KSZ9896CTXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm			e3			14 mm
KSZ8794CNXCC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC60,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N60		.9 mm	8 mm			e3			8 mm
KSZ9893RNXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-N64		.9 mm	8 mm			e3			8 mm
KSZ9896CTXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm			e3			14 mm
LAN9303M-AKZE	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	Network Interfaces	.5 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N72		1 mm	10 mm	Not Qualified		e3			10 mm
KSZ8895RQXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128	1	3.4 mm	14 mm			e3	30	260	20 mm
KSZ8995M	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		375 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ9563RNXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-N64	3	.9 mm	8 mm			e3	30	260	8 mm
KSZ8997	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.1 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8873MLL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
KSZ9563RNXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-N64	3	.9 mm	8 mm			e3	30	260	8 mm
KSZ8895RQXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3	30	260	20 mm
KSZ8864CNXCA	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ8873RLL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
KSZ8895MQXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8895FQXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8863FLL	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
LAN9303-ABZJ-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel		QUAD	S-XQCC-N56		1 mm	8 mm						8 mm
KSZ8873MLLV	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.8 V		FLATPACK, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8863FLL-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
KSZ8993M	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8864CNXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ8993ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8995FQ	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		230 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8873MML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3			10 mm
KSZ8995X	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		375 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified		e3			20 mm
LAN9303M-AKZE-CAG	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	70 Cel		QUAD	S-XQCC-N72		1 mm	10 mm						10 mm
LAN9354/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
KSZ8765CLXCC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.47SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm			e3			10 mm
LAN9354T/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
KSZ8873FLL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
KSZ8864CNXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3	30	260	8 mm
KSZ8864CNXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3		260	8 mm
LAN9312-NZW	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	295 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	HQFP128,.63SQ,16	Network Interfaces	.4 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm	Not Qualified		e3			14 mm
LAN9355/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.5SQ,20		.5 mm	70 Cel		QUAD	S-XQCC-N88		1 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm
LAN9355/PT	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm
KSZ8893FQL	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.