Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
256 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
120 mA |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
Other Telecom ICs |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G256 |
1.6 mm |
28 mm |
Not Qualified |
e3 |
28 mm |
|||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
40 |
260 |
14 mm |
||||||||
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
256 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
175 mA |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
Other Telecom ICs |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G256 |
1.6 mm |
28 mm |
Not Qualified |
e3 |
28 mm |
|||||||
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
256 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
130 mA |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G256 |
1.6 mm |
28 mm |
28 mm |
||||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.01 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
14 mm |
|||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B208 |
3 |
1.97 mm |
17 mm |
Not Qualified |
e1 |
17 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
PQFP64,.48SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
1.2 mm |
10 mm |
e3 |
10 mm |
||||||||||
|
Microsemi |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
15 mA |
5 V |
5 |
FLATPACK |
QFP64,.7X.95,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G64 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
14 mm |
||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
14 mm |
||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
40 |
260 |
14 mm |
||||||||
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B208 |
3 |
1.97 mm |
17 mm |
Not Qualified |
e0 |
30 |
225 |
17 mm |
|||||||||
|
NXP Semiconductors |
ETHERNET SWITCH |
INDUSTRIAL |
BALL |
159 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; ISO 26262 |
200 mA |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA159,14X14,32 |
.8 mm |
105 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B159 |
1.5 mm |
12 mm |
12 mm |
|||||||||||
|
NXP Semiconductors |
ETHERNET SWITCH |
INDUSTRIAL |
BALL |
159 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; ISO 26262 |
200 mA |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA159,14X14,32 |
.8 mm |
105 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B159 |
1.5 mm |
12 mm |
12 mm |
|||||||||||
Microchip Technology |
ETHERNET SWITCH |
INDUSTRIAL |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
7600 mA |
1 V |
GRID ARRAY |
BGA672,26X26,40 |
1 mm |
110 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B672 |
2.71 mm |
27 mm |
27 mm |
|||||||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.38 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA208,16X16,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B208 |
3 |
1.97 mm |
17 mm |
Not Qualified |
e1 |
30 |
260 |
17 mm |
||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.045 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.7X.9 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
260 |
20 mm |
|||||
|
Microchip Technology |
ETHERNET SWITCH |
INDUSTRIAL |
GULL WING |
128 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
295 mA |
3.3 V |
3.3/3.6 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP128,.63SQ,16 |
Network Interfaces |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||
|
Microchip Technology |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
160 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
250 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP160,1.0SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G160 |
1.6 mm |
24 mm |
Not Qualified |
e3 |
24 mm |
|||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B208 |
3 |
1.97 mm |
17 mm |
Not Qualified |
e1 |
260 |
17 mm |
|||||||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
80 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP80,.55SQ |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G80 |
1.2 mm |
12 mm |
12 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N72 |
1 mm |
10 mm |
10 mm |
||||||||||||
|
Microchip Technology |
ETHERNET SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
e3 |
10 mm |
||||||||||
|
Microchip Technology |
ETHERNET SWITCH |
INDUSTRIAL |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
115 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
e3 |
10 mm |
||||||||||
Microchip Technology |
ETHERNET SWITCH |
INDUSTRIAL |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
8100 mA |
1 V |
GRID ARRAY |
BGA672,26X26,40 |
1 mm |
110 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B672 |
2.71 mm |
27 mm |
27 mm |
|||||||||||||
|
NXP Semiconductors |
ETHERNET SWITCH |
INDUSTRIAL |
BALL |
159 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; ISO 26262 |
200 mA |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA159,14X14,32 |
.8 mm |
105 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B159 |
1.5 mm |
12 mm |
12 mm |
|||||||||||
|
NXP Semiconductors |
ETHERNET SWITCH |
INDUSTRIAL |
BALL |
159 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; ISO 26262 |
200 mA |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA159,14X14,32 |
.8 mm |
105 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B159 |
1.5 mm |
12 mm |
12 mm |
|||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.01 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.6 mm |
Not Qualified |
e0 |
16.6 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.25 mA |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
e0 |
23 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
23 mm |
||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.2 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.7X.9 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.2 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.7X.9 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.25 mA |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
e0 |
23 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
23 mm |
||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
23 mm |
||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
.01 mA |
5 V |
5 |
IN-LINE |
DIP40,.6 |
Other Telecom ICs |
2.54 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T40 |
5.1 mm |
15.24 mm |
Not Qualified |
e0 |
50.9 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
217 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.25 mA |
3.3 V |
3.3,5 |
GRID ARRAY |
BGA217,17X17,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B217 |
2.35 mm |
23 mm |
Not Qualified |
e0 |
23 mm |
|||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||||||
Infineon Technologies |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.2 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.7X.9 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.01 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
Other Telecom ICs |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
30 |
240 |
14 mm |
|||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.005 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1 |
4.57 mm |
16.5862 mm |
Not Qualified |
e3 |
30 |
260 |
16.5862 mm |
||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.005 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J44 |
1 |
4.57 mm |
16.5862 mm |
Not Qualified |
e3 |
30 |
260 |
16.5862 mm |
||||
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
3 |
1.97 mm |
13 mm |
Not Qualified |
e1 |
260 |
13 mm |
Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.
Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.
TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.
Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.
Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.