INDUSTRIAL Telecom - Switching ICs 257

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

ZL50020QCG1

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

256

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

120 mA

1.8 V

1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

Other Telecom ICs

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G256

1.6 mm

28 mm

Not Qualified

e3

28 mm

IDT72V70190PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

14 mm

Not Qualified

e3

40

260

14 mm

ZL50022QCG1

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

256

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

175 mA

1.8 V

1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

Other Telecom ICs

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G256

1.6 mm

28 mm

Not Qualified

e3

28 mm

ZL50023QCG1

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

256

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

130 mA

1.8 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G256

1.6 mm

28 mm

28 mm

72V70200PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

IDT72V70200PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

14 mm

IDT72V70190PFG

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

14 mm

Not Qualified

e3

14 mm

IDT72V71660BBG

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B208

3

1.97 mm

17 mm

Not Qualified

e1

17 mm

LAN9353TI/PT

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PQFP64,.48SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.2 mm

10 mm

e3

10 mm

MT90812AL1

Microsemi

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

15 mA

5 V

5

FLATPACK

QFP64,.7X.95,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G64

3.4 mm

14 mm

Not Qualified

e3

20 mm

72V70190PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

72V70800PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

IDT72V70800PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

14 mm

Not Qualified

e3

40

260

14 mm

IDT72V73263BB

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B208

3

1.97 mm

17 mm

Not Qualified

e0

30

225

17 mm

SJA1105REL

NXP Semiconductors

ETHERNET SWITCH

INDUSTRIAL

BALL

159

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; ISO 26262

200 mA

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA159,14X14,32

.8 mm

105 Cel

-40 Cel

BOTTOM

S-PBGA-B159

1.5 mm

12 mm

12 mm

SJA1105SEL

NXP Semiconductors

ETHERNET SWITCH

INDUSTRIAL

BALL

159

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; ISO 26262

200 mA

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA159,14X14,32

.8 mm

105 Cel

-40 Cel

BOTTOM

S-PBGA-B159

1.5 mm

12 mm

12 mm

VSC7448YIH-02

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

7600 mA

1 V

GRID ARRAY

BGA672,26X26,40

1 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B672

2.71 mm

27 mm

27 mm

72V73273BBG

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.38 mA

3.3 V

3.3

GRID ARRAY

BGA208,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B208

3

1.97 mm

17 mm

Not Qualified

e1

30

260

17 mm

72V90823PQFG

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.045 mA

3.3 V

3.3

FLATPACK

QFP100,.7X.9

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G100

3

3.4 mm

14 mm

Not Qualified

e3

260

20 mm

LAN9311I-NZW

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

295 mA

3.3 V

3.3/3.6

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

Network Interfaces

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

Not Qualified

e3

14 mm

ZL50012QCG1

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

160

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

250 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP160,1.0SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G160

1.6 mm

24 mm

Not Qualified

e3

24 mm

72V73263BBG

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B208

3

1.97 mm

17 mm

Not Qualified

e1

260

17 mm

IDT72V90823PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

14 mm

LAN9352I/PT

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G80

1.2 mm

12 mm

12 mm

LAN9352TI/ML

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC72,.39SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N72

1 mm

10 mm

10 mm

KSZ8462FHLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

KSZ8852HLEYA

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

115 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

VSC7449YIH-02

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

8100 mA

1 V

GRID ARRAY

BGA672,26X26,40

1 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B672

2.71 mm

27 mm

27 mm

SJA1105PEL

NXP Semiconductors

ETHERNET SWITCH

INDUSTRIAL

BALL

159

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; ISO 26262

200 mA

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA159,14X14,32

.8 mm

105 Cel

-40 Cel

BOTTOM

S-PBGA-B159

1.5 mm

12 mm

12 mm

SJA1105QEL

NXP Semiconductors

ETHERNET SWITCH

INDUSTRIAL

BALL

159

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; ISO 26262

200 mA

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA159,14X14,32

.8 mm

105 Cel

-40 Cel

BOTTOM

S-PBGA-B159

1.5 mm

12 mm

12 mm

PEF2046-N

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J44

4.57 mm

16.6 mm

Not Qualified

e0

16.6 mm

PEF20470MTSI-L

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.65 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PEF24471HTSI-XL

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

217

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.25 mA

3.3 V

3.3,5

GRID ARRAY

BGA217,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B217

2.35 mm

23 mm

Not Qualified

e0

23 mm

PEF20451

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

217

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3,5

GRID ARRAY

BGA217,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B217

2.35 mm

23 mm

Not Qualified

23 mm

PEF20450

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.2 mA

3.3 V

3.3

FLATPACK

QFP100,.7X.9

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PEF20450MTSI

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.65 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PEF20470

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.2 mA

3.3 V

3.3

FLATPACK

QFP100,.7X.9

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PEF20471HTSI-L

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

217

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.25 mA

3.3 V

3.3,5

GRID ARRAY

BGA217,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B217

2.35 mm

23 mm

Not Qualified

e0

23 mm

PEF24471

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

217

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3,5

GRID ARRAY

BGA217,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B217

2.35 mm

23 mm

Not Qualified

23 mm

PEF20471

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

217

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3,5

GRID ARRAY

BGA217,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B217

2.35 mm

23 mm

Not Qualified

23 mm

PEF2046-P

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.01 mA

5 V

5

IN-LINE

DIP40,.6

Other Telecom ICs

2.54 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T40

5.1 mm

15.24 mm

Not Qualified

e0

50.9 mm

PEF20451HTSI

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

217

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.25 mA

3.3 V

3.3,5

GRID ARRAY

BGA217,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B217

2.35 mm

23 mm

Not Qualified

e0

23 mm

PEF24470MTSI-XL

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.65 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PEF24470

Infineon Technologies

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.2 mA

3.3 V

3.3

FLATPACK

QFP100,.7X.9

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

72V70190PF8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

.01 mA

3.3 V

3.3

FLATPACK, LOW PROFILE

QFP64,.6SQ,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.6 mm

14 mm

Not Qualified

e0

30

240

14 mm

72V8981JG

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.005 mA

3.3 V

3.3

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

1

4.57 mm

16.5862 mm

Not Qualified

e3

30

260

16.5862 mm

72V8981JG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.005 mA

3.3 V

3.3

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-J44

1

4.57 mm

16.5862 mm

Not Qualified

e3

30

260

16.5862 mm

72V71650BBG

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.97 mm

13 mm

Not Qualified

e1

260

13 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.