BALL Telecom - Switching ICs 62

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SJA1105RELY	NXP Semiconductors	ETHERNET SWITCH		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159	3	1.5 mm	12 mm					260	12 mm
VSC7429XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B672		2.44 mm	27 mm			e1			27 mm
VSC7420XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7428XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7425XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7423XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm						27 mm
VSC7514XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm						17 mm
MT90869AG2	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		200 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B272	3	2.32 mm	27 mm	Not Qualified		e1			27 mm
IDT72V71660BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified		e1			17 mm
VSC7440XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V		GRID ARRAY	BGA324,18X18,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm						19 mm
IDT72V73263BB	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified		e0	30	225	17 mm
VSC7422XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
SJA1105REL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SJA1105SEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
VSC7424XJG-02	Microchip Technology	ETHERNET SWITCH		BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm						27 mm
VSC7428XJG-12	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7448YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			7600 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
72V73273BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.38 mA	3.3 V	3.3	GRID ARRAY	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified		e1	30	260	17 mm
72V73263BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified		e1		260	17 mm
VSC7421XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7546TSN-V/5CC-VAO	Microchip Technology	ETHERNET SWITCH		BALL	888	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		.9 V		GRID ARRAY, FINE PITCH	BGA888,30X30,32		.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B888		2.806 mm	24.6 mm						24.6 mm
VSC7513XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM53115MKPBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY	BGA484,22X22,40		1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B484		2.43 mm	23 mm						23 mm
BCM88690CB1KFSBG	Broadcom	ETHERNET SWITCH		BALL	4344	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY	BGA4344,66X66,40		1 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	S-PBGA-B4344		5.64 mm	67.5 mm			e1			67.5 mm
VSC7420XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7427XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7436XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V		GRID ARRAY	BGA324,18X18,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm						19 mm
VSC7449YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			8100 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
VSC7468YIH-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			8600 mA	1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
SJA1105PEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SJA1105QEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SJA1110BEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		ISO 26262; AEC-Q100		1.8 V		GRID ARRAY							BOTTOM	R-PBGA-B256	3				ALSO OPERATES WITH NOMINAL 2.5V AND 3.3V SUPPLY			260
SJA1110CEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262		1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32		.8 mm				BOTTOM	S-PBGA-B256	3	1.5 mm	14 mm		ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY			260	14 mm
PEF24471HTSI-XL	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.25 mA	3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified		e0			23 mm
PEF20451	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified					23 mm
PEF20471HTSI-L	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.25 mA	3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified		e0			23 mm
PEF24471	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified					23 mm
PEF20471	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified					23 mm
PEF20451HTSI	Infineon Technologies	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.25 mA	3.3 V	3.3,5	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.35 mm	23 mm	Not Qualified		e0			23 mm
72V71650BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.97 mm	13 mm	Not Qualified		e1		260	13 mm
72V73250BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B144	3	1.97 mm	13 mm	Not Qualified		e1	NOT SPECIFIED	260	13 mm
72V73273BB	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.38 mA	3.3 V	3.3	GRID ARRAY	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified		e0	30	225	17 mm
72V71643BCG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.075 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.97 mm	13 mm	Not Qualified		e1	30	260	13 mm
72V73263BB	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.38 mA	3.3 V	3.3	GRID ARRAY	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified		e0	30	225	17 mm
72V90823BCG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	100	BGA	SQUARE	PLASTIC/EPOXY	YES				.045 mA	3.3 V	3.3	GRID ARRAY	BGA100,10X10,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3			Not Qualified		e1		260
72V90823BCG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			.045 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3	1.5 mm	11 mm	Not Qualified		e1		260	11 mm
72V73260BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.97 mm	13 mm	Not Qualified		e1		260	13 mm
IDT72V70200BCG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100		1.5 mm	11 mm	Not Qualified		e1			11 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.