NO LEAD Telecom - Switching ICs 51

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

LAN9303I-ABZJ

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

8 mm

Not Qualified

e3

260

8 mm

KSZ8864CNXIA

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

e3

260

8 mm

LAN9303I-ABZJ-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

8 mm

e3

260

8 mm

KSZ9893RNXC

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-N64

.9 mm

8 mm

e3

8 mm

KSZ8794CNXIC

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

60

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC60,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N60

3

.9 mm

8 mm

e3

260

8 mm

KSZ9893RNXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N64

.9 mm

8 mm

8 mm

KSZ9893RNXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N64

.9 mm

8 mm

e3

8 mm

KSZ8794CNXIC-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N64

.9 mm

8 mm

8 mm

LAN9303-ABZJ

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N56

1 mm

8 mm

Not Qualified

e3

8 mm

KSZ8864CNXIA-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

e3

260

8 mm

KSZ8794CNXCC-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

QUAD

S-XQCC-N64

.9 mm

8 mm

8 mm

KSZ8794CNXCC

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

60

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC60,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N60

.9 mm

8 mm

e3

8 mm

KSZ9893RNXC-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-N64

.9 mm

8 mm

e3

8 mm

LAN9303M-AKZE

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

1.8,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC72,.39SQ,20

Network Interfaces

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N72

1 mm

10 mm

Not Qualified

e3

10 mm

KSZ9563RNXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N64

3

.9 mm

8 mm

e3

30

260

8 mm

KSZ9563RNXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N64

3

.9 mm

8 mm

e3

30

260

8 mm

KSZ9563RNXC-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-N64

3

.9 mm

8 mm

e3

30

260

8 mm

KSZ9563RNXC

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-N64

3

.9 mm

8 mm

e3

30

260

8 mm

LAN9303MI-AKZE

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

1.8,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC72,.39SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N72

1 mm

10 mm

Not Qualified

e3

10 mm

KSZ8864CNXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

.9 mm

8 mm

SEATED HT-CALCULATED

e3

260

8 mm

KSZ8864CNXCA

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

e3

30

260

8 mm

VSC7512XMY

Microchip Technology

ETHERNET SWITCH

AUTOMOTIVE

NO LEAD

172

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1600 mA

1 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC172,.52SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N172

.9 mm

13 mm

13 mm

KSZ8563RNXV-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N64

.9 mm

8 mm

8 mm

KSZ8864CNXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

.9 mm

8 mm

SEATED HT-CALCULATED

e3

260

8 mm

VSC7511XMY

Microchip Technology

ETHERNET SWITCH

AUTOMOTIVE

NO LEAD

172

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1600 mA

1 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC172,.52SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N172

.9 mm

13 mm

13 mm

LAN9354I/ML

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

8 mm

integrated 1.2V regulator

e3

30

260

8 mm

KSZ8563RNXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N64

.9 mm

8 mm

8 mm

KSZ8563RNXV-TRVAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N64

.9 mm

8 mm

8 mm

LAN9303-ABZJ-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N56

1 mm

8 mm

8 mm

KSZ8563RNXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N64

.9 mm

8 mm

8 mm

KSZ8563RNXV

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N64

.9 mm

8 mm

8 mm

KSZ8864CNXCA-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

e3

30

260

8 mm

KSZ8563RNXV-VAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N64

.9 mm

8 mm

8 mm

LAN9353I/ML

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

1 mm

9 mm

e3

40

260

9 mm

LAN9354TI/ML

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

8 mm

integrated 1.2V regulator

e3

30

260

8 mm

KSZ8864RMNUB-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100; TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

SEATED HT-CALCULATED

e3

8 mm

KSZ8864RMNUB

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100; TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

.9 mm

8 mm

SEATED HT-CALCULATED

e3

40

260

8 mm

LAN9303M-AKZE-CAG

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC72,.39SQ,20

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N72

1 mm

10 mm

10 mm

LAN9354/ML

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

8 mm

integrated 1.2V regulator

e3

30

260

8 mm

KSZ8864RMNI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

SEATED HT-CALCULATED

e3

30

260

8 mm

LAN9354T/ML

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

8 mm

integrated 1.2V regulator

e3

30

260

8 mm

KSZ8864RMNUB-VAO

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

SEATED HT-CALCULATED

e3

30

260

8 mm

KSZ8864CNXC-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

SEATED HT-CALCULATED

e3

30

260

8 mm

LAN9353/ML

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

1 mm

9 mm

e3

40

260

9 mm

LAN9353TI/ML

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

1 mm

9 mm

e3

40

260

9 mm

KSZ8864CNXC

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

SEATED HT-CALCULATED

e3

260

8 mm

LAN9355I/ML

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.5SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N88

1 mm

12 mm

NOT SPECIFIED

NOT SPECIFIED

12 mm

LAN9355/ML

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.5SQ,20

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N88

1 mm

12 mm

NOT SPECIFIED

NOT SPECIFIED

12 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.