Broadcom Telecom - Switching ICs 17

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

BCM53125B0MKMMLG

Broadcom

ETHERNET SWITCH

UNSPECIFIED

186

SQUARE

UNSPECIFIED

1

UNSPECIFIED

S-XXSS-X

3

260

BCM53115MKPBG

Broadcom

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BGA484,22X22,40

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B484

2.43 mm

23 mm

23 mm

BCM88690CB1KFSBG

Broadcom

ETHERNET SWITCH

BALL

4344

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

BGA4344,66X66,40

1 mm

70 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

S-PBGA-B4344

5.64 mm

67.5 mm

e1

67.5 mm

BCM56784A0KFSBG

Broadcom

ETHERNET SWITCH

BALL

3315

BGA

SQUARE

PLASTIC/EPOXY

YES

1

236470 mA

.75 V

GRID ARRAY

BGA3315,62X107,40

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B3315

4.181 mm

55 mm

55 mm

BCM53115MKPB

Broadcom

ETHERNET TRANSCEIVER

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BGA484,22X22,40

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B484

2.43 mm

23 mm

23 mm

BCM56072A0KFSBG

Broadcom

ETHERNET SWITCH

BALL

896

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

23846.4 mA

.88 V

GRID ARRAY, FINE PITCH

BGA896,30X30,32

.8 mm

70 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B896

2.768 mm

25 mm

e1

25 mm

BCM88850

Broadcom

ETHERNET SWITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

e4

BCM88790

Broadcom

ETHERNET SWITCH

COMMERCIAL

BCM56990

Broadcom

ETHERNET SWITCH

NO LEAD

8371

LGA

RECTANGULAR

UNSPECIFIED

YES

1

.75 V

GRID ARRAY

BGA8371,98X170,35

.9 mm

70 Cel

0 Cel

BOTTOM

R-XBGA-N8371

5.138 mm

77.5 mm

77.8 mm

BCM56780A0KFSBG

Broadcom

ETHERNET SWITCH

BALL

3315

BGA

SQUARE

PLASTIC/EPOXY

YES

1

246610 mA

.75 V

GRID ARRAY

BGA3315,62X107,40

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B3315

4.181 mm

55 mm

55 mm

BCM56071NA0KFSBG

Broadcom

ETHERNET SWITCH

BALL

896

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

23846.4 mA

.88 V

GRID ARRAY, FINE PITCH

BGA896,30X30,32

.8 mm

70 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B896

2.768 mm

25 mm

e1

25 mm

BCM53115MIPB

Broadcom

ETHERNET TRANSCEIVER

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BGA484,22X22,40

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B484

2.43 mm

23 mm

23 mm

T-8110L---BAL-DB

Broadcom

DIGITAL TIME SWITCH

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

GRID ARRAY

BGA272,20X20,50

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B272

2.32 mm

27 mm

Not Qualified

e0

30

225

27 mm

BCM5395MKFBG

Broadcom

ETHERNET SWITCH

1

CMOS

BCM56636B0KFSBG

Broadcom

ETHERNET SWITCH

BCM88375CB0IFSBG

Broadcom

ETHERNET SWITCH

BCM89200

Broadcom

ETHERNET SWITCH

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

FLATPACK

QUAD

S-PQFP-G176

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.