Microchip Technology Telecom - Switching ICs 182

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
VSC7425XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
ZL50011/QCC	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	160	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			250 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP160,1.0SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G160		1.6 mm	24 mm	Not Qualified	e0			24 mm
VSC7423XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm					27 mm
VSC7514XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm					17 mm
MT90869AG2	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		200 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B272	3	2.32 mm	27 mm	Not Qualified	e1			27 mm
ZL50020QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			120 mA	1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G256		1.6 mm	28 mm	Not Qualified	e3			28 mm
ZL50022QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			175 mA	1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G256		1.6 mm	28 mm	Not Qualified	e3			28 mm
ZL50023QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			130 mA	1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G256		1.6 mm	28 mm					28 mm
LAN9355/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.5SQ,20		.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N88		1 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	12 mm
LAN9355/PT	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	12 mm
KSZ8893FQL	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified	e3			20 mm
KSZ8893FQL-FX	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified	e3			20 mm
LAN9353TI/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm		e3			10 mm
VSC7440XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V		GRID ARRAY	BGA324,18X18,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm					19 mm
KSZ8775CLXCC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	SPQFP80,.48SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm		e3			10 mm
VSC7422XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
VSC7424XJG-02	Microchip Technology	ETHERNET SWITCH		BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm					27 mm
VSC7428XJG-12	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
VSC7448YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			7600 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm					27 mm
KSZ8993	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			330 mA	2.5 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified	e3			20 mm
LAN9311I-NZW	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	295 mA	3.3 V	3.3/3.6	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	Network Interfaces	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm	Not Qualified	e3			14 mm
ZL50012QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	160	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			250 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP160,1.0SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G160		1.6 mm	24 mm	Not Qualified	e3			24 mm
KSZ8895FQXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	20 mm
LAN9352/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm					12 mm
LAN9352I/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm					12 mm
LAN9352T/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm					12 mm
LAN9352TI/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N72		1 mm	10 mm					10 mm
VSC7421XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
VSC7546TSN-V/5CC-VAO	Microchip Technology	ETHERNET SWITCH		BALL	888	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		.9 V		GRID ARRAY, FINE PITCH	BGA888,30X30,32		.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B888		2.806 mm	24.6 mm					24.6 mm
VSC7513XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm					17 mm
KSZ8462FHLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm		e3			10 mm
KSZ8852HLEYA	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	115 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm		e3			10 mm
KSZ8895MLXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm		e3			14 mm
VSC7420XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
VSC7427XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
VSC7436XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V		GRID ARRAY	BGA324,18X18,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm					19 mm
VSC7449YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			8100 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm					27 mm
VSC7468YIH-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			8600 mA	1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm					27 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.