NXP Semiconductors Telecom - Switching ICs 9

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	Peak Reflow Temperature (C)	Length
SJA1105RELY	NXP Semiconductors	ETHERNET SWITCH		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32	.8 mm	105 Cel	-40 Cel	BOTTOM	S-PBGA-B159	3	1.5 mm	12 mm			260	12 mm
SJA1105REL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32	.8 mm	105 Cel	-40 Cel	BOTTOM	S-PBGA-B159		1.5 mm	12 mm				12 mm
SJA1105SEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32	.8 mm	105 Cel	-40 Cel	BOTTOM	S-PBGA-B159		1.5 mm	12 mm				12 mm
SC2000	NXP Semiconductors	DIGITAL TIME SWITCH	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	CHIP CARRIER		1.27 mm	70 Cel	0 Cel	QUAD	S-PQCC-J68		4.57 mm	25.146 mm	Not Qualified			25.146 mm
SJA1105PEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32	.8 mm	105 Cel	-40 Cel	BOTTOM	S-PBGA-B159		1.5 mm	12 mm				12 mm
SJA1105QEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32	.8 mm	105 Cel	-40 Cel	BOTTOM	S-PBGA-B159		1.5 mm	12 mm				12 mm
SC4000	NXP Semiconductors	DIGITAL TIME SWITCH	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	FLATPACK, LOW PROFILE, FINE PITCH		.5 mm	70 Cel	0 Cel	QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified			14 mm
SJA1110BEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		ISO 26262; AEC-Q100		1.8 V	GRID ARRAY					BOTTOM	R-PBGA-B256	3				ALSO OPERATES WITH NOMINAL 2.5V AND 3.3V SUPPLY	260
SJA1110CEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262		1.8 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	.8 mm			BOTTOM	S-PBGA-B256	3	1.5 mm	14 mm		ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY	260	14 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.