8 Telephone Line ICs 119

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Crystal Frequency (MHz)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Make-break Ratio	Length
LH1028BB	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BCDMOS				IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	50 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
L3240D1	STMicroelectronics	TELEPHONE RINGER CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		26 V	26	SMALL OUTLINE	SOP8,.25	Telephone Circuits	1.27 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G8	1.75 mm	3.9 mm	Not Qualified			e0				4.9 mm
LS1240	STMicroelectronics	TELEPHONE RINGER CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			26 V	26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T8	5.08 mm	7.62 mm	Not Qualified			e0
L3240B1	STMicroelectronics	TELEPHONE RINGER CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T8	5.08 mm	7.62 mm	Not Qualified
ML8204	STMicroelectronics		OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	4.2 mA	29 V	29	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	65 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
ML8205AE	STMicroelectronics		OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		29 V	29	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	65 Cel	-45 Cel		DUAL	R-PDIP-T8			Not Qualified
LB1005BB	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	.9 mA		TIP-RING VOLTAGE	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T8			Not Qualified
LS1241	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		26 V	26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
935008930118	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified				40	260		7.55 mm
PCD3312TD	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.2 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.86 mm	7.55 mm	Not Qualified							7.75 mm
PCD3312PN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		1.2 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8	4.2 mm	7.62 mm	Not Qualified
PCD3312TD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.2 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.86 mm	7.55 mm	Not Qualified							7.75 mm
PCD3312CT-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified							7.55 mm
935008930112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified				40	260		7.55 mm
PCD3312CTD	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.9 mA	3 V	3/5	SMALL OUTLINE	SOP8,.25	Telephone Circuits	1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3	3.58				1:1	7.55 mm
935008920112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8	4.2 mm	7.62 mm	Not Qualified				40	250		9.5 mm
PCD3312CTD-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.9 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3					1:1	7.55 mm
PCD3312CP	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0009 mA	3 V	3/5	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T8	4.2 mm	7.62 mm	Not Qualified		3.58					9.5 mm
PCD3312CPN	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8	4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3					1:1	9.5 mm
MC34017AD	NXP Semiconductors	TELEPHONE RINGER CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				SMALL OUTLINE	SOP8,.25	Telephone Circuits	1.27 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G8	1.75 mm	3.9 mm	Not Qualified							4.9 mm
MC34017A-3D	NXP Semiconductors		COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			20 mA		2,5	SMALL OUTLINE	SOP8,.25	Telephone Circuits	1.27 mm	60 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8			Not Qualified			e0
MC34017D	NXP Semiconductors	TELEPHONE RINGER CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G8	1.75 mm	3.9 mm	Not Qualified							4.9 mm
MC34017A-3DR2	NXP Semiconductors		COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			20 mA		2,5	SMALL OUTLINE	SOP8,.25	Telephone Circuits	1.27 mm	60 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8			Not Qualified			e0
MC34017DR2	NXP Semiconductors	TELEPHONE RINGER CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				SMALL OUTLINE			1.27 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G8	1.75 mm	3.9 mm	Not Qualified							4.9 mm
MC34017AP	NXP Semiconductors	TELEPHONE RINGER CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR				IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	60 Cel	-20 Cel		DUAL	R-PDIP-T8	5.334 mm	7.62 mm	Not Qualified							9.78 mm
MC34017ADR2	NXP Semiconductors		COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOP8,.25	Telephone Circuits	1.27 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G8			Not Qualified
MC34017P	NXP Semiconductors	TELEPHONE RINGER CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	60 Cel	-20 Cel		DUAL	R-PDIP-T8	4.45 mm	7.62 mm	Not Qualified							9.78 mm
PSB6521-2	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	22 mA		TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
PSB6521P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
PSB6520	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
PSB6520P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
PSB6520-2	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	22 mA		TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
PSB6523-T	Infineon Technologies		COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	11 mA		TIP-RING/8.8/36	SMALL OUTLINE	SOP8,.25	Telephone Circuits	1.27 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8			Not Qualified			e0
PSB6531	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	20 mA		TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
PSB6521	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
PSB6530	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	20 mA		TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
PSB6520-2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			TIP-RING/8.8/26	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8			Not Qualified			e0
TA31001F-TP1	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified				NOT SPECIFIED	240		5 mm
TA31002AF	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified			e0				5 mm
TA31002F-TP1	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified				NOT SPECIFIED	240		5 mm
TA31070P	Toshiba	TELEPHONE RINGER CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	75 Cel	-30 Cel	TIN LEAD	DUAL	R-PDIP-T8	4.25 mm	7.62 mm	Not Qualified			e0				9.6 mm
TA31001F-TP2	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified				NOT SPECIFIED	240		5 mm
TA31002AP	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T8	4.25 mm	7.62 mm	Not Qualified			e0				9.6 mm
TA31002AF(ER)	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified				NOT SPECIFIED	240		5 mm
TA31002AF-TP2	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified				NOT SPECIFIED	240		5 mm
TA31001F	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified			e0				5 mm
TA31002F-TP2	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified				NOT SPECIFIED	240		5 mm
TA31002F(ER)	Toshiba	TELEPHONE RINGER CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8	1.9 mm	4.4 mm	Not Qualified				NOT SPECIFIED	240		5 mm

Telephone Line ICs

Telephone Line ICs are electronic components used in telephone systems to interface with the telephone line and provide necessary functionality for telephone communication. These ICs are designed to provide reliable and efficient operation of the telephone line, allowing for clear and uninterrupted communication between two devices.

Telephone Line ICs use various techniques to interface with the telephone line, including pulse dialing, dual-tone multi-frequency (DTMF) signaling, and loop current sensing. Pulse dialing is used to send a series of electrical pulses over the telephone line to dial a phone number. DTMF signaling is used to send a sequence of tones to control various telephone functions, such as call forwarding and call waiting. Loop current sensing is used to detect the presence of a telephone off-hook condition, allowing the telephone system to provide appropriate signaling and call management.

Some common features of Telephone Line ICs include:

1. Telephone line interface: Telephone Line ICs provide the necessary interface with the telephone line to enable telephone communication.

2. Signal processing: Telephone Line ICs are designed to process signals quickly and efficiently, ensuring clear and uninterrupted communication.

3. Tone generation and detection: Telephone Line ICs can generate and detect various tones used for telephone communication, such as dial tones and busy signals.

4. Call management: Telephone Line ICs can provide call management functions, such as call waiting and call forwarding.

Telephone Line ICs are used in a variety of telephone systems, including traditional landline phones, cordless phones, and PBX (Private Branch Exchange) systems. They are also used in other communication systems that require telephone line interface, such as alarm systems and security systems.