Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Crydom |
Heat Sink |
Screw |
Aluminium Alloy |
Relay |
Longitudinal |
2 Ω |
3.15 in (80 mm) |
1.772 in (45 mm) |
353 g |
3.189 in (81 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium Alloy |
Transistor |
Transverse |
25 Ω |
0.807 in (20.5 mm) |
0.276 in (7 mm) |
Anodized |
Black |
0.984 in (25 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Clip |
Aluminium Alloy |
Transistor |
Extruded |
Longitudinal |
11 Ω |
1.201 in (30.5 mm) |
0.63 in (16 mm) |
Anodized |
Black |
Bulk |
12 g |
0.909 in (23.1 mm) |
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|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
10.03 Ω |
0.472 in (12 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
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|
TE Connectivity |
Heat Sink |
Clip/Screw |
Aluminium Alloy |
Fin |
Longitudinal |
0.404 in (10.27 mm) |
3.37 in (85.6 mm) |
Anodized |
4.39 in (111.5 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Clip |
Aluminium Alloy |
Extruded |
4.2 Ω |
1.969 in (50 mm) |
1.063 in (27 mm) |
Anodized |
Black |
85 g |
2.953 in (75 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium Alloy |
Semiconductor |
Extruded |
Fin Pin |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Bulk |
3.8 g |
1.02 in (25.91 mm) |
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|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.906 in (23 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
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Vicor |
Heat Sink |
Aluminium Alloy |
Extruded |
0.909 in (23.1 mm) |
2.22 in (56.4 mm) |
2.28 in (57.9 mm) |
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Cts |
Heat Sink |
Adhesive |
Aluminium Alloy |
IC |
9.9 Ω |
0.5 in (12.7 mm) |
1.575 in (40 mm) |
Anodized |
Black |
1.575 in (40 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium Alloy |
Transistor |
Longitudinal |
11.4 Ω |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Bulk |
18 g |
1.378 in (35 mm) |
|||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
12.93 Ω |
0.906 in (23 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
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|
Cincon Electronics |
Heat Sink |
Screw |
Aluminium Alloy |
Fin |
Longitudinal |
1 in (25.4 mm) |
2.433 in (61.8 mm) |
Black Anodized |
Black |
4.598 in (116.8 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium Alloy |
Longitudinal |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
1.772 in (45 mm) |
|||||||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
9.95 Ω |
0.906 in (23 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
9.18 Ω |
0.472 in (12 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
Assmann Wsw Components |
Heat Sink |
Aluminium Alloy |
Transistor |
Folded Back |
21 Ω |
0.252 in (6.4 mm) |
0.878 in (22.3 mm) |
Anodized |
Black |
1.409 in (35.8 mm) |
|||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.827 in (21 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.