Copper Heat Sinks 25

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

FK24413D2PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Bulk

3.6 g

1.024 in (26 mm)

FK24413D2PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.6 g

1.024 in (26 mm)

FK24408D2PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2.2 g

1.024 in (26 mm)

FK24413D3PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

1.22 in (31 mm)

Tin Lead

3.9 g

0.512 in (13 mm)

7109DG/TR

Boyd

Heat Sink

Copper

IC

Folded Back

11 Ω

0.45 in (11.43 mm)

0.763 in (19.38 mm)

Tin

Tape and Reel

1 in (25.4 mm)

7109DG

Boyd

Heat Sink

Copper

IC

Folded Back

11 Ω

0.763 in (19.38 mm)

0.45 in (11.43 mm)

Tin

1 in (25.4 mm)

FK24413DPAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.3 g

0.906 in (23 mm)

7106DG/TR

Boyd

Heat Sink

Solder

Copper

IC

15 Ω

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

Tape and Reel

1.02 in (25.91 mm)

7106DG

Boyd

Heat Sink

Copper

Transistor

15 Ω

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

1.02 in (25.91 mm)

FK24408D3PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2.5 g

1.22 in (31 mm)

FK24408D2PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Tape and Reel

2.2 g

1.024 in (26 mm)

573100D00010G

Boyd

Heat Sink

U

Copper

Fin

Longitudinal

15 Ω

0.4 in (10.16 mm)

0.315 in (8 mm)

Tin

Gray

Tape and Reel, 13 in

0.9 in (22.86 mm)

PF750G

Boyd

Heat Sink

U

Copper

20.3 Ω

0.866 in (22 mm)

0.433 in (11 mm)

Tin

0.866 in (22 mm)

FK24408DPAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2 g

0.906 in (23 mm)

FK24413DPAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Bulk

3.3 g

0.906 in (23 mm)

FK24413D3PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.9 g

1.22 in (31 mm)

7106D/TRG

Boyd

Heat Sink

Solder

Copper

IC

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

Tape and Reel, 13 in

1.02 in (25.91 mm)

FK24408DPAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Tape and Reel

2 g

0.906 in (23 mm)

573300D00000G

Boyd

Heat Sink

U

Copper

Fin

18 Ω

0.4 in (10.16 mm)

0.5 in (12.7 mm)

Tin

1.03 in (26.16 mm)

6032DG

Boyd

Heat Sink

Copper

Staggered

8.3 Ω

2 in (50.8 mm)

Tin

7136DG

Boyd

Heat Sink

U

Copper

Clip

Transverse

19.7 Ω

0.848 in (21.54 mm)

0.515 in (13.08 mm)

Tin

0.52 in (13.21 mm)

573100D00000G

Boyd

Heat Sink

Copper

15 Ω

0.4 in (10.16 mm)

0.315 in (8 mm)

Tin

0.9 in (22.86 mm)

7106PD/TR

Boyd

Heat Sink

Copper

15 Ω

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

Tape and Reel

1.02 in (25.91 mm)

7140DG

Boyd

Heat Sink

U

Copper

Transverse

20.8 Ω

0.7 in (17.78 mm)

0.375 in (9.52 mm)

Tin

0.52 in (13.2 mm)

FK245MI247H

Fischer Elektronik & Kg

Heat Sink

Clip

Copper

Transistor

U

Transverse

20.5 Ω

0.354 in (9 mm)

0.787 in (20 mm)

1.063 in (27 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.