Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Boyd |
Heat Sink |
U |
Extruded |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Tin/Nickel |
Gray |
Tape and Reel, 13 in |
1.03 in (26.16 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Transistor |
Extruded |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
Tape and Reel, 13 in |
3.8 g |
1.02 in (25.91 mm) |
||||||||
|
Ohmite Manufacturing |
Heat Sink |
Clip |
Aluminium Alloy |
Transistor |
Extruded |
Longitudinal |
11 Ω |
1.201 in (30.5 mm) |
0.63 in (16 mm) |
Anodized |
Black |
Bulk |
12 g |
0.909 in (23.1 mm) |
|||||
|
Boyd |
Heat Sink |
Aluminium |
IC |
Extruded |
Longitudinal |
17.4 Ω |
1 in (25.4 mm) |
0.64 in (16.26 mm) |
Anodized |
Black |
0.64 in (16.26 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
13.4 Ω |
1 in (25.4 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.374 in (34.9 mm) |
|||||||||
|
Wakefield-vette |
Heat Sink |
Extruded |
2.626 in (66.7 mm) |
4.752 in (120.7 mm) |
530.71 g |
5.52 in (140.2 mm) |
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|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
10.03 Ω |
0.472 in (12 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
||||||||
|
Wakefield-vette |
Heat Sink |
Extruded |
1 in (25.4 mm) |
1 in (25.4 mm) |
24.95 g |
1.65 in (41.9 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
3.7 Ω |
1.5 in (38.1 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Staggered |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.374 in (34.9 mm) |
|||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Longitudinal |
27.2 Ω |
0.19 in (4.83 mm) |
0.53 in (13.46 mm) |
Anodized |
Black |
2 in (50.8 mm) |
|||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Transistor |
Extruded |
Fin Pin |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
Bulk |
3.8 g |
1.02 in (25.91 mm) |
|||||||
|
Boyd |
Heat Sink |
Aluminium |
Transistor |
Extruded |
Radial |
3.3 Ω |
2 in (50.8 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.949 in (24.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Clip |
Aluminium Alloy |
Extruded |
4.2 Ω |
1.969 in (50 mm) |
1.063 in (27 mm) |
Anodized |
Black |
85 g |
2.953 in (75 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium Alloy |
Semiconductor |
Extruded |
Fin Pin |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Bulk |
3.8 g |
1.02 in (25.91 mm) |
|||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
13 Ω |
0.984 in (25 mm) |
0.492 in (12.5 mm) |
Anodized |
Black |
1.358 in (34.5 mm) |
|||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
13.1 Ω |
1.1 in (27.94 mm) |
0.106 in (2.7 mm) |
Anodized |
Black |
0.787 in (20 mm) |
||||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.906 in (23 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
||||||||
Vicor |
Heat Sink |
Aluminium Alloy |
Extruded |
0.909 in (23.1 mm) |
2.22 in (56.4 mm) |
2.28 in (57.9 mm) |
||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
7.8 Ω |
1.102 in (28 mm) |
0.764 in (19.4 mm) |
1.181 in (30 mm) |
|||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Longitudinal |
32 Ω |
0.19 in (4.83 mm) |
0.53 in (13.46 mm) |
Anodized |
Black |
1.45 in (36.83 mm) |
|||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
4.8 Ω |
2 in (50.8 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
|||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
0.25 in (6.35 mm) |
Anodized |
0.305 in (7.75 mm) |
Black |
||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
56 Ω |
0.25 in (6.35 mm) |
Anodized |
Black |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
3.5 Ω |
0.787 in (20 mm) |
2.559 in (65 mm) |
Anodized |
Black |
3.937 in (100 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
13.3 Ω |
1.102 in (28 mm) |
0.764 in (19.4 mm) |
0.591 in (15 mm) |
|||||||||||
|
Wakefield-vette |
Heat Sink |
Aluminium |
Extruded |
0.24 in (6.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
|||||||||||
|
Advanced Thermal Solutions |
Heat Sink |
Chromate |
Extruded |
Longitudinal |
0.902 in (22.9 mm) |
2.323 in (59 mm) |
Gold Anodized |
Maxiflow, Device Used On: Half Brick DC-DC Converter |
2.402 in (61 mm) |
||||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
12.93 Ω |
0.906 in (23 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.949 in (24.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
10.4 Ω |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.375 in (34.92 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
3.937 in (100 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
1.969 in (50 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
2.953 in (75 mm) |
||||||||||
|
Wakefield-vette |
Heat Sink |
Extruded |
2.626 in (66.7 mm) |
4.752 in (120.7 mm) |
285.77 g |
3 in (76.2 mm) |
|||||||||||||
Wakefield-vette |
Heat Sink |
Aluminium |
Extruded |
0.949 in (24.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.449 in (11.4 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.85 Ω |
1.299 in (33 mm) |
1.811 in (46 mm) |
Anodized |
Black |
2.953 in (75 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
3.094 in (78.6 mm) |
3.15 in (80 mm) |
Anodized |
Black |
3.937 in (100 mm) |
||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
1.969 in (50 mm) |
0.492 in (12.5 mm) |
Anodized |
Black |
1.358 in (34.5 mm) |
||||||||||
Wakefield-vette |
Heat Sink |
Aluminium |
Extruded |
1.5 in (38.1 mm) |
2 in (50.8 mm) |
Anodized |
Black |
60.33 g |
2 in (50.8 mm) |
|||||||||||
Ohmite Manufacturing |
Heat Sink |
Extruded |
1.252 in (31.8 mm) |
4.752 in (120.7 mm) |
68.04 g |
1.5 in (38.1 mm) |
||||||||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.449 in (11.4 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
9.95 Ω |
0.906 in (23 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
9.18 Ω |
0.472 in (12 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.1 Ω |
0.591 in (15 mm) |
6.26 in (159 mm) |
Anodized |
Natural |
39.37 in (1000 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
3.5 Ω |
0.787 in (20 mm) |
2.559 in (65 mm) |
Anodized |
Black |
39.37 in (1000 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.