Fin Heat Sinks 50

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

ICKBGA35X35

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

1.378 in (35 mm)

Black Anodized

1.378 in (35 mm)

507302B00000G

Boyd

Heat Sink

Screw

Aluminium

Transistor

Fin

Transverse

24 Ω

0.38 in (9.65 mm)

0.75 in (19.05 mm)

Anodized

Black

Low Profile

0.75 in (19.05 mm)

FK237SA220H

Fischer Elektronik & Kg

Heat Sink

Aluminium

Transistor

Fin

0.5 in (12.7 mm)

0.571 in (14.5 mm)

Anodized

Black

0.75 in (19.05 mm)

530613B00000G

Boyd

Heat Sink

U

Aluminium

Fin

Transverse

16.7 Ω

1.18 in (29.97 mm)

0.5 in (12.7 mm)

Anodized

Black

1 in (25.4 mm)

374324B00035G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.394 in (10 mm)

1.063 in (27 mm)

Anodized

Black

1.063 in (27 mm)

1963856-1

TE Connectivity

Heat Sink

Clip/Screw

Aluminium Alloy

Fin

Longitudinal

0.404 in (10.27 mm)

3.37 in (85.6 mm)

Anodized

4.39 in (111.5 mm)

577202B00000G

Boyd

Heat Sink

Aluminium

Fin

Transverse

0.75 in (19.05 mm)

0.5 in (12.7 mm)

Anodized

Black

0.52 in (13.21 mm)

624-25AB-T4E

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.252 in (6.4 mm)

0.827 in (21 mm)

Anodized

Black

4.09 g

0.827 in (21 mm)

7023BG

Boyd

Heat Sink

Aluminium

Fin

Folded Back

4.4 Ω

1.75 in (44.45 mm)

0.95 in (24.13 mm)

Anodized

Black

1.9 in (48.26 mm)

573100D00010G

Boyd

Heat Sink

U

Copper

Fin

Longitudinal

15 Ω

0.4 in (10.16 mm)

0.315 in (8 mm)

Tin

Gray

Tape and Reel, 13 in

0.9 in (22.86 mm)

577002B00000G

Boyd

Heat Sink

U

Aluminium

Fin

Longitudinal

32 Ω

0.75 in (19.05 mm)

0.25 in (6.35 mm)

Anodized

Black

0.52 in (13.21 mm)

ICKBGA31X31X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.22 in (31 mm)

Black Anodized

1.22 in (31 mm)

507002B00000G

Boyd

Heat Sink

U

Aluminium

Fin

Longitudinal

15.6 Ω

0.7 in (17.78 mm)

0.375 in (9.52 mm)

Anodized

Black

1.75 in (44.45 mm)

ICKBGA14X14X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

0.551 in (14 mm)

Black Anodized

0.551 in (14 mm)

577202B04000G

Boyd

Heat Sink

U

Aluminium

Fin

Transverse

24.4 Ω

0.75 in (19.05 mm)

0.5 in (12.7 mm)

Anodized

Black

0.52 in (13.21 mm)

374424B00035G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.709 in (18 mm)

1.063 in (27 mm)

Anodized

Black

1.063 in (27 mm)

577102B04000G

Boyd

Heat Sink

U

Aluminium

Fin

Transverse

25.9 Ω

0.75 in (19.05 mm)

0.375 in (9.52 mm)

Anodized

Black

0.52 in (13.21 mm)

573300D00000G

Boyd

Heat Sink

U

Copper

Fin

18 Ω

0.4 in (10.16 mm)

0.5 in (12.7 mm)

Tin

1.03 in (26.16 mm)

ICKBGA10X10X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

0.394 in (10 mm)

Black Anodized

0.394 in (10 mm)

ICKBGA40X40X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.575 in (40 mm)

Black Anodized

1.575 in (40 mm)

6022BG

Boyd

Heat Sink

Aluminium

Fin

16.7 Ω

1.25 in (31.75 mm)

0.25 in (6.35 mm)

Anodized

Black

0.875 in (22.23 mm)

ICKBGA27X27X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.063 in (27 mm)

Black Anodized

1.063 in (27 mm)

ICKBGA35X35X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.378 in (35 mm)

Black Anodized

1.378 in (35 mm)

ICKBGA23X23

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

0.906 in (23 mm)

Black Anodized

0.906 in (23 mm)

M-C092

Mean Well Enterprises

Heat Sink

Fin

Transverse

3 Ω

CUL; UL

1 in (25.4 mm)

2.283 in (58 mm)

Approvals: CE; EAC

25 g

2.402 in (61 mm)

593002B03400G

Boyd

Heat Sink

U

Aluminium

Fin

13.4 Ω

1.18 in (29.97 mm)

0.5 in (12.7 mm)

Anodized

Black

0.942 in (23.93 mm)

658-35AB

Ohmite Manufacturing

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.35 in (8.9 mm)

1.098 in (27.9 mm)

Anodized

Black

6.7 g

1.098 in (27.9 mm)

658-35AB-T4

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.35 in (8.89 mm)

1.21 in (30.73 mm)

Anodized

Black

1.21 in (30.73 mm)

625-25AB-T4E

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.252 in (6.4 mm)

0.984 in (25 mm)

Anodized

Black

5.45 g

0.984 in (25 mm)

658-60AB

Ohmite Manufacturing

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.598 in (15.2 mm)

1.098 in (27.9 mm)

Anodized

Black

14.17 g

1.098 in (27.9 mm)

658-60AB-T3

Wakefield-vette

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.598 in (15.2 mm)

1.098 in (27.9 mm)

Anodized

Black

14.17 g

1.098 in (27.9 mm)

512-9M

Wakefield-vette

Heat Sink

Fin

Longitudinal

2.35 in (59.7 mm)

7.2 in (182.88 mm)

9 in (228.6 mm)

630-45AB

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.449 in (11.4 mm)

1.378 in (35 mm)

Anodized

Black

6.81 g

1.378 in (35 mm)

374724B60024G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.709 in (18 mm)

1.378 in (35 mm)

Anodized

Black

1.378 in (35 mm)

ICKBGA10X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

0.394 in (10 mm)

Black Anodized

0.394 in (10 mm)

ICKBGA27X27X22

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.866 in (22 mm)

1.063 in (27 mm)

Black Anodized

1.063 in (27 mm)

M-B012

Cincon Electronics

Heat Sink

Screw

Aluminium Alloy

Fin

Longitudinal

1 in (25.4 mm)

2.433 in (61.8 mm)

Black Anodized

Black

4.598 in (116.8 mm)

218-40CTE5

Wakefield-vette

Heat Sink

U

Aluminium

Fin

Folded Back

0.402 in (10.2 mm)

0.5 in (12.7 mm)

Anodized

Black

1.031 in (26.2 mm)

ICKBGA23X23X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

0.906 in (23 mm)

Black Anodized

0.906 in (23 mm)

242-125ABE-22

Wakefield-vette

Heat Sink

Aluminium

Fin

Staggered

1.283 in (32.6 mm)

0.252 in (6.4 mm)

Anodized

Black

0.874 in (22.2 mm)

578622B03200G

Boyd

Heat Sink

U

Aluminium

Transistor

Fin

Transverse

13.2 Ω

1 in (25.4 mm)

0.5 in (12.7 mm)

Anodized

Black

1.48 in (37.59 mm)

APA501-60-001

Artesyn Embedded Technologies

Heat Sink

Pin Fin Array

Fin

Longitudinal

0.591 in (15 mm)

2.264 in (57.5 mm)

2.323 in (59 mm)

APA501-60-003

Artesyn Embedded Technologies

Heat Sink

Pin Fin Array

Fin

Longitudinal

0.902 in (22.9 mm)

2.264 in (57.5 mm)

2.323 in (59 mm)

ATS-1039-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.591 in (15 mm)

1.575 in (40 mm)

Anodized

Green

2.087 in (53 mm)

ATS-1039-C2-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.591 in (15 mm)

1.575 in (40 mm)

Anodized

Green

2.087 in (53 mm)

ICKBGA14X14

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

0.551 in (14 mm)

Black Anodized

0.551 in (14 mm)

512-3U

Wakefield-vette

Heat Sink

Fin

Longitudinal

2.409 in (61.2 mm)

7.2 in (182.88 mm)

3 in (76.2 mm)

552844B00000G

Boyd

Heat Sink

Aluminium

Fin

8.7 Ω

0.72 in (18.29 mm)

1.78 in (45.2 mm)

Anodized

Black

1.78 in (45.2 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.