Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
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|
Boyd |
Heat Sink |
Screw |
Aluminium |
Transistor |
Fin |
Transverse |
24 Ω |
0.38 in (9.65 mm) |
0.75 in (19.05 mm) |
Anodized |
Black |
Low Profile |
0.75 in (19.05 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
Transistor |
Fin |
0.5 in (12.7 mm) |
0.571 in (14.5 mm) |
Anodized |
Black |
0.75 in (19.05 mm) |
||||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
16.7 Ω |
1.18 in (29.97 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1 in (25.4 mm) |
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|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.394 in (10 mm) |
1.063 in (27 mm) |
Anodized |
Black |
1.063 in (27 mm) |
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|
TE Connectivity |
Heat Sink |
Clip/Screw |
Aluminium Alloy |
Fin |
Longitudinal |
0.404 in (10.27 mm) |
3.37 in (85.6 mm) |
Anodized |
4.39 in (111.5 mm) |
||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Fin |
Transverse |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
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|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.252 in (6.4 mm) |
0.827 in (21 mm) |
Anodized |
Black |
4.09 g |
0.827 in (21 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Fin |
Folded Back |
4.4 Ω |
1.75 in (44.45 mm) |
0.95 in (24.13 mm) |
Anodized |
Black |
1.9 in (48.26 mm) |
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|
Boyd |
Heat Sink |
U |
Copper |
Fin |
Longitudinal |
15 Ω |
0.4 in (10.16 mm) |
0.315 in (8 mm) |
Tin |
Gray |
Tape and Reel, 13 in |
0.9 in (22.86 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Longitudinal |
32 Ω |
0.75 in (19.05 mm) |
0.25 in (6.35 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Longitudinal |
15.6 Ω |
0.7 in (17.78 mm) |
0.375 in (9.52 mm) |
Anodized |
Black |
1.75 in (44.45 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.551 in (14 mm) |
Black Anodized |
0.551 in (14 mm) |
||||||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
24.4 Ω |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
||||||||
|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.709 in (18 mm) |
1.063 in (27 mm) |
Anodized |
Black |
1.063 in (27 mm) |
|||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
25.9 Ω |
0.75 in (19.05 mm) |
0.375 in (9.52 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
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|
Boyd |
Heat Sink |
U |
Copper |
Fin |
18 Ω |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Tin |
1.03 in (26.16 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.394 in (10 mm) |
Black Anodized |
0.394 in (10 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Fin |
16.7 Ω |
1.25 in (31.75 mm) |
0.25 in (6.35 mm) |
Anodized |
Black |
0.875 in (22.23 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.906 in (23 mm) |
Black Anodized |
0.906 in (23 mm) |
||||||||||||
|
Mean Well Enterprises |
Heat Sink |
Fin |
Transverse |
3 Ω |
CUL; UL |
1 in (25.4 mm) |
2.283 in (58 mm) |
Approvals: CE; EAC |
25 g |
2.402 in (61 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
13.4 Ω |
1.18 in (29.97 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.942 in (23.93 mm) |
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Ohmite Manufacturing |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.35 in (8.9 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
6.7 g |
1.098 in (27.9 mm) |
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|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.35 in (8.89 mm) |
1.21 in (30.73 mm) |
Anodized |
Black |
1.21 in (30.73 mm) |
|||||||||
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.252 in (6.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
5.45 g |
0.984 in (25 mm) |
||||||||
Ohmite Manufacturing |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.598 in (15.2 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
14.17 g |
1.098 in (27.9 mm) |
||||||||||
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.598 in (15.2 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
14.17 g |
1.098 in (27.9 mm) |
|||||||||
Wakefield-vette |
Heat Sink |
Fin |
Longitudinal |
2.35 in (59.7 mm) |
7.2 in (182.88 mm) |
9 in (228.6 mm) |
||||||||||||||
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.449 in (11.4 mm) |
1.378 in (35 mm) |
Anodized |
Black |
6.81 g |
1.378 in (35 mm) |
||||||||
|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.709 in (18 mm) |
1.378 in (35 mm) |
Anodized |
Black |
1.378 in (35 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.394 in (10 mm) |
Black Anodized |
0.394 in (10 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.866 in (22 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
||||||||||||
|
Cincon Electronics |
Heat Sink |
Screw |
Aluminium Alloy |
Fin |
Longitudinal |
1 in (25.4 mm) |
2.433 in (61.8 mm) |
Black Anodized |
Black |
4.598 in (116.8 mm) |
|||||||||
|
Wakefield-vette |
Heat Sink |
U |
Aluminium |
Fin |
Folded Back |
0.402 in (10.2 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.031 in (26.2 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.906 in (23 mm) |
Black Anodized |
0.906 in (23 mm) |
||||||||||||
|
Wakefield-vette |
Heat Sink |
Aluminium |
Fin |
Staggered |
1.283 in (32.6 mm) |
0.252 in (6.4 mm) |
Anodized |
Black |
0.874 in (22.2 mm) |
||||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Transistor |
Fin |
Transverse |
13.2 Ω |
1 in (25.4 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.48 in (37.59 mm) |
|||||||
Artesyn Embedded Technologies |
Heat Sink |
Pin Fin Array |
Fin |
Longitudinal |
0.591 in (15 mm) |
2.264 in (57.5 mm) |
2.323 in (59 mm) |
|||||||||||||
Artesyn Embedded Technologies |
Heat Sink |
Pin Fin Array |
Fin |
Longitudinal |
0.902 in (22.9 mm) |
2.264 in (57.5 mm) |
2.323 in (59 mm) |
|||||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.591 in (15 mm) |
1.575 in (40 mm) |
Anodized |
Green |
2.087 in (53 mm) |
|||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.591 in (15 mm) |
1.575 in (40 mm) |
Anodized |
Green |
2.087 in (53 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.551 in (14 mm) |
Black Anodized |
0.551 in (14 mm) |
||||||||||||
Wakefield-vette |
Heat Sink |
Fin |
Longitudinal |
2.409 in (61.2 mm) |
7.2 in (182.88 mm) |
3 in (76.2 mm) |
||||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Fin |
8.7 Ω |
0.72 in (18.29 mm) |
1.78 in (45.2 mm) |
Anodized |
Black |
1.78 in (45.2 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.