IC Heat Sinks 41

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

FK24413D2PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Bulk

3.6 g

1.024 in (26 mm)

ICKBGA35X35

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

1.378 in (35 mm)

Black Anodized

1.378 in (35 mm)

FK24413D2PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.6 g

1.024 in (26 mm)

FK24408D2PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2.2 g

1.024 in (26 mm)

FK24413D3PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

1.22 in (31 mm)

Tin Lead

3.9 g

0.512 in (13 mm)

7109DG/TR

Boyd

Heat Sink

Copper

IC

Folded Back

11 Ω

0.45 in (11.43 mm)

0.763 in (19.38 mm)

Tin

Tape and Reel

1 in (25.4 mm)

7109DG

Boyd

Heat Sink

Copper

IC

Folded Back

11 Ω

0.763 in (19.38 mm)

0.45 in (11.43 mm)

Tin

1 in (25.4 mm)

581002B02500G

Boyd

Heat Sink

Aluminium

IC

Extruded

Longitudinal

17.4 Ω

1 in (25.4 mm)

0.64 in (16.26 mm)

Anodized

Black

0.64 in (16.26 mm)

FK24413DPAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.3 g

0.906 in (23 mm)

ICKPGA6X6X14

Fischer Elektronik & Kg

Heat Sink

Adhesive

IC

Omnidirectional

20 Ω

0.551 in (14 mm)

0.551 in (14 mm)

Anodized

Black

0.551 in (14 mm)

7106DG/TR

Boyd

Heat Sink

Solder

Copper

IC

15 Ω

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

Tape and Reel

1.02 in (25.91 mm)

908-35-2-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

10.03 Ω

0.472 in (12 mm)

1.378 in (35 mm)

Black Anodized

1.378 in (35 mm)

FK24408D3PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2.5 g

1.22 in (31 mm)

FK24408D2PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Tape and Reel

2.2 g

1.024 in (26 mm)

FK24408DPAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2 g

0.906 in (23 mm)

FK24413DPAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Bulk

3.3 g

0.906 in (23 mm)

FK24413D3PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.9 g

1.22 in (31 mm)

1-1542002-0

TE Connectivity

Heat Sink

Clip

Aluminium

IC

Radial

UL

15 W

ICKBGA31X31X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.22 in (31 mm)

Black Anodized

1.22 in (31 mm)

7106D/TRG

Boyd

Heat Sink

Solder

Copper

IC

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

Tape and Reel, 13 in

1.02 in (25.91 mm)

FK24408DPAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Tape and Reel

2 g

0.906 in (23 mm)

ICKBGA14X14X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

0.551 in (14 mm)

Black Anodized

0.551 in (14 mm)

906-31-2-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

12.02 Ω

0.906 in (23 mm)

1.22 in (31 mm)

Black Anodized

1.22 in (31 mm)

ICKBGA10X10X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

0.394 in (10 mm)

Black Anodized

0.394 in (10 mm)

ICKBGA40X40X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.575 in (40 mm)

Black Anodized

1.575 in (40 mm)

3-1542003-4

TE Connectivity

Heat Sink

Clip

Aluminium

IC

Radial

UL

15 W

ICKBGA27X27X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.063 in (27 mm)

Black Anodized

1.063 in (27 mm)

ICKBGA35X35X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.378 in (35 mm)

Black Anodized

1.378 in (35 mm)

ICKBGA23X23

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

0.906 in (23 mm)

Black Anodized

0.906 in (23 mm)

APF40-40-13CB/A01

Cts

Heat Sink

Adhesive

Aluminium Alloy

IC

9.9 Ω

0.5 in (12.7 mm)

1.575 in (40 mm)

Anodized

Black

1.575 in (40 mm)

904-27-1-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Elliptical Fin

12.93 Ω

0.906 in (23 mm)

1.063 in (27 mm)

Black Anodized

1.063 in (27 mm)

ICKBGA10X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

0.394 in (10 mm)

Black Anodized

0.394 in (10 mm)

ICKBGA27X27X22

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.866 in (22 mm)

1.063 in (27 mm)

Black Anodized

1.063 in (27 mm)

ICKBGA23X23X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

0.906 in (23 mm)

Black Anodized

0.906 in (23 mm)

910-40-1-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Elliptical Fin

9.95 Ω

0.906 in (23 mm)

1.575 in (40 mm)

Black Anodized

1.575 in (40 mm)

910-40-2-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

9.18 Ω

0.472 in (12 mm)

1.575 in (40 mm)

Black Anodized

1.575 in (40 mm)

ICKBGA14X14

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

0.551 in (14 mm)

Black Anodized

0.551 in (14 mm)

7106D

Boyd

Heat Sink

Copper Alloy

IC

U

Folded Back

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin Lead

Low Profile

Bag

1.02 in (25.91 mm)

7106D/TR

Boyd

Heat Sink

Copper Alloy

IC

U

Folded Back

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin Lead

Low Profile

Tape and Reel, 13 in

1.02 in (25.91 mm)

906-31-2-21-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

12.02 Ω

0.827 in (21 mm)

1.22 in (31 mm)

Black Anodized

1.22 in (31 mm)

HTS501-P

TE Connectivity

Heat Sink

Clip

Aluminium

IC

Radial

UL

0.357 in (9.06 mm)

1.375 in (34.92 mm)

15 W

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.