Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Bulk |
3.6 g |
1.024 in (26 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Tape and Reel |
3.6 g |
1.024 in (26 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Bulk |
2.2 g |
1.024 in (26 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
1.22 in (31 mm) |
Tin Lead |
3.9 g |
0.512 in (13 mm) |
|||||||||||
|
Boyd |
Heat Sink |
Copper |
IC |
Folded Back |
11 Ω |
0.45 in (11.43 mm) |
0.763 in (19.38 mm) |
Tin |
Tape and Reel |
1 in (25.4 mm) |
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|
Boyd |
Heat Sink |
Copper |
IC |
Folded Back |
11 Ω |
0.763 in (19.38 mm) |
0.45 in (11.43 mm) |
Tin |
1 in (25.4 mm) |
||||||||||
|
Boyd |
Heat Sink |
Aluminium |
IC |
Extruded |
Longitudinal |
17.4 Ω |
1 in (25.4 mm) |
0.64 in (16.26 mm) |
Anodized |
Black |
0.64 in (16.26 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Tape and Reel |
3.3 g |
0.906 in (23 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
IC |
Omnidirectional |
20 Ω |
0.551 in (14 mm) |
0.551 in (14 mm) |
Anodized |
Black |
0.551 in (14 mm) |
|||||||||
|
Boyd |
Heat Sink |
Solder |
Copper |
IC |
15 Ω |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin |
Tape and Reel |
1.02 in (25.91 mm) |
|||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
10.03 Ω |
0.472 in (12 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Bulk |
2.5 g |
1.22 in (31 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Tape and Reel |
2.2 g |
1.024 in (26 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Bulk |
2 g |
0.906 in (23 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Bulk |
3.3 g |
0.906 in (23 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Tape and Reel |
3.9 g |
1.22 in (31 mm) |
|||||||||||
|
TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
15 W |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
||||||||||||
|
Boyd |
Heat Sink |
Solder |
Copper |
IC |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin |
Tape and Reel, 13 in |
1.02 in (25.91 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Tape and Reel |
2 g |
0.906 in (23 mm) |
|||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.551 in (14 mm) |
Black Anodized |
0.551 in (14 mm) |
||||||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.906 in (23 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.394 in (10 mm) |
Black Anodized |
0.394 in (10 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||||||
|
TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
15 W |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.906 in (23 mm) |
Black Anodized |
0.906 in (23 mm) |
||||||||||||
Cts |
Heat Sink |
Adhesive |
Aluminium Alloy |
IC |
9.9 Ω |
0.5 in (12.7 mm) |
1.575 in (40 mm) |
Anodized |
Black |
1.575 in (40 mm) |
||||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
12.93 Ω |
0.906 in (23 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.394 in (10 mm) |
Black Anodized |
0.394 in (10 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.866 in (22 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.906 in (23 mm) |
Black Anodized |
0.906 in (23 mm) |
||||||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
9.95 Ω |
0.906 in (23 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
9.18 Ω |
0.472 in (12 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.551 in (14 mm) |
Black Anodized |
0.551 in (14 mm) |
||||||||||||
Boyd |
Heat Sink |
Copper Alloy |
IC |
U |
Folded Back |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin Lead |
Low Profile |
Bag |
1.02 in (25.91 mm) |
|||||||||
Boyd |
Heat Sink |
Copper Alloy |
IC |
U |
Folded Back |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin Lead |
Low Profile |
Tape and Reel, 13 in |
1.02 in (25.91 mm) |
|||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.827 in (21 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
||||||||
|
TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
0.357 in (9.06 mm) |
1.375 in (34.92 mm) |
15 W |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.