Folded Back Heat Sinks 11

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

7109DG/TR

Boyd

Heat Sink

Copper

IC

Folded Back

11 Ω

0.45 in (11.43 mm)

0.763 in (19.38 mm)

Tin

Tape and Reel

1 in (25.4 mm)

7109DG

Boyd

Heat Sink

Copper

IC

Folded Back

11 Ω

0.763 in (19.38 mm)

0.45 in (11.43 mm)

Tin

1 in (25.4 mm)

574502B03300G

Boyd

Heat Sink

Aluminium

Slide On

Folded Back

21.2 Ω

0.75 in (19.05 mm)

0.39 in (9.9 mm)

Anodized

Black

0.81 in (20.57 mm)

7023BG

Boyd

Heat Sink

Aluminium

Fin

Folded Back

4.4 Ω

1.75 in (44.45 mm)

0.95 in (24.13 mm)

Anodized

Black

1.9 in (48.26 mm)

574602B03300G

Boyd

Heat Sink

U

Aluminium

Slide On

Folded Back

21.6 Ω

0.69 in (17.53 mm)

0.355 in (9.02 mm)

Anodized

Black

0.86 in (21.84 mm)

218-40CTE5

Wakefield-vette

Heat Sink

U

Aluminium

Fin

Folded Back

0.402 in (10.2 mm)

0.5 in (12.7 mm)

Anodized

Black

1.031 in (26.2 mm)

574902B03300G

Boyd

Heat Sink

Aluminium

Slide On

Folded Back

16 Ω

1.375 in (34.93 mm)

0.355 in (9.02 mm)

Anodized

Black

0.86 in (21.84 mm)

574602B03300

Boyd

Heat Sink

Aluminium

Transistor

Folded Back

0.027 in (0.69 mm)

0.016 in (0.395 mm)

Black Anodized

Black

0.034 in (0.86 mm)

V5641A-T

Assmann Wsw Components

Heat Sink

Aluminium Alloy

Transistor

Folded Back

21 Ω

0.252 in (6.4 mm)

0.878 in (22.3 mm)

Anodized

Black

1.409 in (35.8 mm)

7106D

Boyd

Heat Sink

Copper Alloy

IC

U

Folded Back

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin Lead

Low Profile

Bag

1.02 in (25.91 mm)

7106D/TR

Boyd

Heat Sink

Copper Alloy

IC

U

Folded Back

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin Lead

Low Profile

Tape and Reel, 13 in

1.02 in (25.91 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.