Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Crydom |
Heat Sink |
Screw |
Aluminium Alloy |
Relay |
Longitudinal |
2 Ω |
3.15 in (80 mm) |
1.772 in (45 mm) |
353 g |
3.189 in (81 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Clip |
Aluminium Alloy |
Transistor |
Extruded |
Longitudinal |
11 Ω |
1.201 in (30.5 mm) |
0.63 in (16 mm) |
Anodized |
Black |
Bulk |
12 g |
0.909 in (23.1 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
IC |
Extruded |
Longitudinal |
17.4 Ω |
1 in (25.4 mm) |
0.64 in (16.26 mm) |
Anodized |
Black |
0.64 in (16.26 mm) |
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|
TE Connectivity |
Heat Sink |
Clip/Screw |
Aluminium Alloy |
Fin |
Longitudinal |
0.404 in (10.27 mm) |
3.37 in (85.6 mm) |
Anodized |
4.39 in (111.5 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Longitudinal |
27.2 Ω |
0.19 in (4.83 mm) |
0.53 in (13.46 mm) |
Anodized |
Black |
2 in (50.8 mm) |
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|
Boyd |
Heat Sink |
U |
Copper |
Fin |
Longitudinal |
15 Ω |
0.4 in (10.16 mm) |
0.315 in (8 mm) |
Tin |
Gray |
Tape and Reel, 13 in |
0.9 in (22.86 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Longitudinal |
32 Ω |
0.75 in (19.05 mm) |
0.25 in (6.35 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Longitudinal |
15.6 Ω |
0.7 in (17.78 mm) |
0.375 in (9.52 mm) |
Anodized |
Black |
1.75 in (44.45 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
7.8 Ω |
1.102 in (28 mm) |
0.764 in (19.4 mm) |
1.181 in (30 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Longitudinal |
32 Ω |
0.19 in (4.83 mm) |
0.53 in (13.46 mm) |
Anodized |
Black |
1.45 in (36.83 mm) |
|||||||||
|
Assmann Wsw Components |
Heat Sink |
Aluminium |
Longitudinal |
12 Ω |
0.472 in (12 mm) |
0.787 in (20 mm) |
Black Anodized |
Black |
1.142 in (29 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
3.5 Ω |
0.787 in (20 mm) |
2.559 in (65 mm) |
Anodized |
Black |
3.937 in (100 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
13.3 Ω |
1.102 in (28 mm) |
0.764 in (19.4 mm) |
0.591 in (15 mm) |
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|
Advanced Thermal Solutions |
Heat Sink |
Chromate |
Extruded |
Longitudinal |
0.902 in (22.9 mm) |
2.323 in (59 mm) |
Gold Anodized |
Maxiflow, Device Used On: Half Brick DC-DC Converter |
2.402 in (61 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium Alloy |
Transistor |
Longitudinal |
11.4 Ω |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Bulk |
18 g |
1.378 in (35 mm) |
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Wakefield-vette |
Heat Sink |
Fin |
Longitudinal |
2.35 in (59.7 mm) |
7.2 in (182.88 mm) |
9 in (228.6 mm) |
||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
3.937 in (100 mm) |
||||||||||
|
Cincon Electronics |
Heat Sink |
Screw |
Aluminium Alloy |
Fin |
Longitudinal |
1 in (25.4 mm) |
2.433 in (61.8 mm) |
Black Anodized |
Black |
4.598 in (116.8 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium Alloy |
Longitudinal |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
1.772 in (45 mm) |
|||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
1.969 in (50 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
2.953 in (75 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.85 Ω |
1.299 in (33 mm) |
1.811 in (46 mm) |
Anodized |
Black |
2.953 in (75 mm) |
||||||||
Artesyn Embedded Technologies |
Heat Sink |
Pin Fin Array |
Fin |
Longitudinal |
0.591 in (15 mm) |
2.264 in (57.5 mm) |
2.323 in (59 mm) |
|||||||||||||
Artesyn Embedded Technologies |
Heat Sink |
Pin Fin Array |
Fin |
Longitudinal |
0.902 in (22.9 mm) |
2.264 in (57.5 mm) |
2.323 in (59 mm) |
|||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.1 Ω |
0.591 in (15 mm) |
6.26 in (159 mm) |
Anodized |
Natural |
39.37 in (1000 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
3.5 Ω |
0.787 in (20 mm) |
2.559 in (65 mm) |
Anodized |
Black |
39.37 in (1000 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.85 Ω |
1.299 in (33 mm) |
1.811 in (46 mm) |
Anodized |
Black |
39.37 in (1000 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.85 Ω |
1.299 in (33 mm) |
1.811 in (46 mm) |
Anodized |
Black |
3.937 in (100 mm) |
||||||||
Wakefield-vette |
Heat Sink |
Fin |
Longitudinal |
2.409 in (61.2 mm) |
7.2 in (182.88 mm) |
3 in (76.2 mm) |
||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.3 Ω |
0.984 in (25 mm) |
1.654 in (42 mm) |
Anodized |
Black |
2 in (50.8 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.