Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2 in (50.8 mm) |
0.984 in (25 mm) |
Anodized |
Black |
51 g |
1.654 in (42 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
IC |
Omnidirectional |
20 Ω |
0.551 in (14 mm) |
0.551 in (14 mm) |
Anodized |
Black |
0.551 in (14 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1 in (25.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
25 g |
1.654 in (42 mm) |
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|
Wakefield-vette |
Heat Sink |
Aluminium |
Omnidirectional |
0.5 in (12.7 mm) |
1.811 in (46 mm) |
Anodized |
Black |
31.75 g |
1.811 in (46 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1.5 in (38.1 mm) |
0.984 in (25 mm) |
Anodized |
Black |
38 g |
1.654 in (42 mm) |
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|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.394 in (10 mm) |
1.063 in (27 mm) |
Anodized |
Black |
1.063 in (27 mm) |
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TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
8.24 Ω |
0.224 in (5.7 mm) |
1.472 in (37.4 mm) |
14.6 g |
1.969 in (50 mm) |
|||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1.5 in (38.1 mm) |
0.984 in (25 mm) |
Anodized |
Black |
27 g |
1.638 in (41.6 mm) |
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TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
10 Ω |
0.22 in (5.6 mm) |
0.953 in (24.2 mm) |
9.49 g |
1.961 in (49.8 mm) |
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|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.252 in (6.4 mm) |
0.827 in (21 mm) |
Anodized |
Black |
4.09 g |
0.827 in (21 mm) |
||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1 in (25.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
17.5 g |
1.638 in (41.6 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2.5 in (63.5 mm) |
0.984 in (25 mm) |
Anodized |
Black |
46 g |
1.638 in (41.6 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
Aluminium |
Omnidirectional |
3.2 Ω |
0.787 in (20 mm) |
1.433 in (36.4 mm) |
Thermal Resistance Min: 0.95 |
24 g |
1.433 in (36.4 mm) |
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|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.709 in (18 mm) |
1.063 in (27 mm) |
Anodized |
Black |
1.063 in (27 mm) |
|||||||||
TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
970 mΩ |
1.378 in (35 mm) |
2.752 in (69.9 mm) |
280 g |
4.803 in (122 mm) |
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TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
1.5 Ω |
1.5 in (38.1 mm) |
2.402 in (61 mm) |
250 g |
4.598 in (116.8 mm) |
|||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2 in (50.8 mm) |
0.984 in (25 mm) |
Anodized |
Black |
37 g |
1.638 in (41.6 mm) |
||||||||||
Ohmite Manufacturing |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.35 in (8.9 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
6.7 g |
1.098 in (27.9 mm) |
||||||||||
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.35 in (8.89 mm) |
1.21 in (30.73 mm) |
Anodized |
Black |
1.21 in (30.73 mm) |
|||||||||
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.252 in (6.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
5.45 g |
0.984 in (25 mm) |
||||||||
Ohmite Manufacturing |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.598 in (15.2 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
14.17 g |
1.098 in (27.9 mm) |
||||||||||
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.598 in (15.2 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
14.17 g |
1.098 in (27.9 mm) |
|||||||||
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.449 in (11.4 mm) |
1.378 in (35 mm) |
Anodized |
Black |
6.81 g |
1.378 in (35 mm) |
||||||||
|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.709 in (18 mm) |
1.378 in (35 mm) |
Anodized |
Black |
1.378 in (35 mm) |
|||||||||
TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
3.5 Ω |
1.5 in (38.1 mm) |
2.402 in (61 mm) |
158 g |
4 in (101.6 mm) |
|||||||||||
|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Adhesive |
Omnidirectional |
0.394 in (10 mm) |
0.906 in (23 mm) |
Anodized |
Black |
0.906 in (23 mm) |
|||||||||
|
Wakefield-vette |
Heat Sink |
Aluminium |
Omnidirectional |
1.252 in (31.8 mm) |
1.811 in (46 mm) |
Anodized |
Black |
49.9 g |
1.811 in (46 mm) |
||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.591 in (15 mm) |
1.575 in (40 mm) |
Anodized |
Green |
2.087 in (53 mm) |
|||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.591 in (15 mm) |
1.575 in (40 mm) |
Anodized |
Green |
2.087 in (53 mm) |
|||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Flared |
Omnidirectional |
0.591 in (15 mm) |
1.614 in (41 mm) |
Anodized |
Green |
2.52 in (64 mm) |
|||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Flared |
Omnidirectional |
0.591 in (15 mm) |
1.614 in (41 mm) |
Anodized |
Green |
2.52 in (64 mm) |
|||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.295 in (7.5 mm) |
1.575 in (40 mm) |
Anodized |
Blue |
1.575 in (40 mm) |
|||||||||||
TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
2.2 Ω |
1 in (25.4 mm) |
2.402 in (61 mm) |
150 g |
4.598 in (116.8 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.