Radial Heat Sinks 14

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Part	Manufacturer	Thermal Device Type	Profile	Body Material	Device Used On	Construction	Fin Orientation	Thermal Resistance	Approvals (V)	Height	Width	Finish	Diameter	Color	Weight	Length	Power (Rated)
531002B00000G	Boyd	Heat Sink		Aluminium		Extruded	Radial	13.4 Ω		1 in (25.4 mm)	0.5 in (12.7 mm)	Anodized		Black		1.374 in (34.9 mm)
637-15ABEP	Ohmite Manufacturing	Heat Sink		Aluminium		Flared	Radial			1.5 in (38.1 mm)	0.5 in (12.7 mm)	Anodized		Black	15.88 g	1.374 in (34.9 mm)
529802B02500G	Boyd	Heat Sink		Aluminium		Extruded	Radial	3.7 Ω		1.5 in (38.1 mm)	1 in (25.4 mm)	Anodized		Black		1.65 in (41.91 mm)
6399BG	Boyd	Heat Sink		Aluminium	Transistor	Extruded	Radial	3.3 Ω		2 in (50.8 mm)	1 in (25.4 mm)	Anodized		Black		1.65 in (41.91 mm)
1-1542002-0	TE Connectivity	Heat Sink	Clip	Aluminium	IC		Radial		UL								15 W
SW25-2G	Boyd	Heat Sink		Aluminium		Extruded	Radial	13 Ω		0.984 in (25 mm)	0.492 in (12.5 mm)	Anodized		Black		1.358 in (34.5 mm)
322400B00000G	Boyd	Heat Sink					Radial	99.99 Ω		0.235 in (5.97 mm)		Anodized		Black
3-1542003-4	TE Connectivity	Heat Sink	Clip	Aluminium	IC		Radial		UL								15 W
532702B02500G	Boyd	Heat Sink		Aluminium		Extruded	Radial	4.8 Ω		2 in (50.8 mm)	1 in (25.4 mm)	Anodized		Black		1.65 in (41.91 mm)
323005B00000G	Boyd	Heat Sink		Aluminium		Extruded	Radial	56 Ω		0.25 in (6.35 mm)		Anodized		Black
531102B00000G	Boyd	Heat Sink		Aluminium		Extruded	Radial	10.4 Ω		1.5 in (38.1 mm)	0.5 in (12.7 mm)	Anodized		Black		1.375 in (34.92 mm)
SW50-4G	Boyd	Heat Sink		Aluminium		Extruded	Radial			1.969 in (50 mm)	0.492 in (12.5 mm)	Anodized		Black		1.358 in (34.5 mm)
321527B00000G	Boyd	Heat Sink					Radial	35.2 Ω		0.5 in (12.7 mm)		Anodized		Black
HTS501-P	TE Connectivity	Heat Sink	Clip	Aluminium	IC		Radial		UL	0.357 in (9.06 mm)			1.375 in (34.92 mm)				15 W

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.