Transverse Heat Sinks 17

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Part	Manufacturer	Thermal Device Type	Profile	Body Material	Device Used On	Construction	Fin Orientation	Thermal Resistance	Approvals (V)	Height	Width	Finish	Color	Additional Features	Weight	Length
FK220SA220	Fischer Elektronik & Kg	Heat Sink		Aluminium Alloy	Transistor		Transverse	25 Ω		0.807 in (20.5 mm)	0.276 in (7 mm)	Anodized	Black			0.984 in (25 mm)
507302B00000G	Boyd	Heat Sink	Screw	Aluminium	Transistor	Fin	Transverse	24 Ω		0.38 in (9.65 mm)	0.75 in (19.05 mm)	Anodized	Black	Low Profile		0.75 in (19.05 mm)
576802B00000G	Boyd	Heat Sink	U	Aluminium		Clip	Transverse	27.3 Ω		0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized	Black			0.57 in (14.48 mm)
530613B00000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	16.7 Ω		1.18 in (29.97 mm)	0.5 in (12.7 mm)	Anodized	Black			1 in (25.4 mm)
577202B00000G	Boyd	Heat Sink		Aluminium		Fin	Transverse			0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized	Black			0.52 in (13.21 mm)
577202B04000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	24.4 Ω		0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized	Black			0.52 in (13.21 mm)
577102B04000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	25.9 Ω		0.75 in (19.05 mm)	0.375 in (9.52 mm)	Anodized	Black			0.52 in (13.21 mm)
7136DG	Boyd	Heat Sink	U	Copper		Clip	Transverse	19.7 Ω		0.848 in (21.54 mm)	0.515 in (13.08 mm)	Tin				0.52 in (13.21 mm)
M-C092	Mean Well Enterprises	Heat Sink				Fin	Transverse	3 Ω	CUL; UL	1 in (25.4 mm)	2.283 in (58 mm)			Approvals: CE; EAC	25 g	2.402 in (61 mm)
PSD1-2CB	Cts	Heat Sink	Screw		Transistor	U	Transverse	14.4 Ω		2.18 in (55.37 mm)	0.5 in (12.7 mm)		Black			1.38 in (35.05 mm)
7140DG	Boyd	Heat Sink	U	Copper			Transverse	20.8 Ω		0.7 in (17.78 mm)	0.375 in (9.52 mm)	Tin				0.52 in (13.2 mm)
578622B03200G	Boyd	Heat Sink	U	Aluminium	Transistor	Fin	Transverse	13.2 Ω		1 in (25.4 mm)	0.5 in (12.7 mm)	Anodized	Black			1.48 in (37.59 mm)
PF433G	Boyd	Heat Sink	Clip	Aluminium	Transistor		Transverse			0.768 in (19.5 mm)	0.512 in (13 mm)	Anodized	Black			0.5 in (12.7 mm)
576802B03900G	Boyd	Heat Sink	U	Aluminium		Clip	Transverse	27.3 Ω		0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized	Black			0.5 in (12.7 mm)
577002B04000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	32 Ω		0.75 in (19.05 mm)	0.25 in (6.35 mm)	Anodized	Black			0.52 in (13.21 mm)
FK235MIL1	Fischer Elektronik & Kg	Heat Sink	Screw		Transistor		Transverse	16 Ω		1.102 in (28 mm)	0.591 in (15 mm)					0.728 in (18.5 mm)
FK245MI247H	Fischer Elektronik & Kg	Heat Sink	Clip	Copper	Transistor	U	Transverse	20.5 Ω		0.354 in (9 mm)	0.787 in (20 mm)					1.063 in (27 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.