Clip Heat Sinks 15

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Part	Manufacturer	Thermal Device Type	Profile	Body Material	Device Used On	Construction	Fin Orientation	Thermal Resistance	Approvals (V)	Height	Width	Finish	Diameter	Color	Packing Method	Weight	Length	Power (Rated)
WA-T247-101E	Ohmite Manufacturing	Heat Sink	Clip	Aluminium Alloy	Transistor	Extruded	Longitudinal	11 Ω		1.201 in (30.5 mm)	0.63 in (16 mm)	Anodized		Black	Bulk	12 g	0.909 in (23.1 mm)
1542618-2	TE Connectivity	Heat Sink	Clip	Cold-Forged Aluminium, Aluminium	Transceiver		Pin Fin		CSA; UL	0.256 in (6.5 mm)	0.709 in (18 mm)	Nickel					2.254 in (57.25 mm)	15 W
908-35-2-23-2-B-0	Wakefield Thermal Solutions	Heat Sink	Clip	Aluminium Alloy	IC	Extruded	Pin Fin	10.03 Ω		0.472 in (12 mm)	1.378 in (35 mm)	Black Anodized					1.378 in (35 mm)
CR101-75AE	Ohmite Manufacturing	Heat Sink	Clip	Aluminium Alloy		Extruded		4.2 Ω		1.969 in (50 mm)	1.063 in (27 mm)	Anodized		Black		85 g	2.953 in (75 mm)
1-1542002-0	TE Connectivity	Heat Sink	Clip	Aluminium	IC		Radial		UL									15 W
906-31-2-23-2-B-0	Wakefield Thermal Solutions	Heat Sink	Clip	Aluminium Alloy	IC	Extruded	Pin Fin	12.02 Ω		0.906 in (23 mm)	1.22 in (31 mm)	Black Anodized					1.22 in (31 mm)
3-1542003-4	TE Connectivity	Heat Sink	Clip	Aluminium	IC		Radial		UL									15 W
904-27-1-23-2-B-0	Wakefield Thermal Solutions	Heat Sink	Clip	Aluminium Alloy	IC	Extruded	Elliptical Fin	12.93 Ω		0.906 in (23 mm)	1.063 in (27 mm)	Black Anodized					1.063 in (27 mm)
910-40-1-23-2-B-0	Wakefield Thermal Solutions	Heat Sink	Clip	Aluminium Alloy	IC	Extruded	Elliptical Fin	9.95 Ω		0.906 in (23 mm)	1.575 in (40 mm)	Black Anodized					1.575 in (40 mm)
910-40-2-23-2-B-0	Wakefield Thermal Solutions	Heat Sink	Clip	Aluminium Alloy	IC	Extruded	Pin Fin	9.18 Ω		0.472 in (12 mm)	1.575 in (40 mm)	Black Anodized					1.575 in (40 mm)
PF433G	Boyd	Heat Sink	Clip	Aluminium	Transistor		Transverse			0.768 in (19.5 mm)	0.512 in (13 mm)	Anodized		Black			0.5 in (12.7 mm)
906-31-2-21-2-B-0	Wakefield Thermal Solutions	Heat Sink	Clip	Aluminium Alloy	IC	Extruded	Pin Fin	12.02 Ω		0.827 in (21 mm)	1.22 in (31 mm)	Black Anodized					1.22 in (31 mm)
FK245MI247H	Fischer Elektronik & Kg	Heat Sink	Clip	Copper	Transistor	U	Transverse	20.5 Ω		0.354 in (9 mm)	0.787 in (20 mm)						1.063 in (27 mm)
1829905-2	TE Connectivity	Heat Sink	Clip	Aluminium, Cold-Forged Aluminium	Transceiver		Pin Fin											15 W
HTS501-P	TE Connectivity	Heat Sink	Clip	Aluminium	IC		Radial		UL	0.357 in (9.06 mm)			1.375 in (34.92 mm)					15 W

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.