Pin Fin Array Heat Sinks 18

Reset All
Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

374324B00035G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.394 in (10 mm)

1.063 in (27 mm)

Anodized

Black

1.063 in (27 mm)

624-25AB-T4E

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.252 in (6.4 mm)

0.827 in (21 mm)

Anodized

Black

4.09 g

0.827 in (21 mm)

374424B00035G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.709 in (18 mm)

1.063 in (27 mm)

Anodized

Black

1.063 in (27 mm)

658-35AB

Ohmite Manufacturing

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.35 in (8.9 mm)

1.098 in (27.9 mm)

Anodized

Black

6.7 g

1.098 in (27.9 mm)

658-35AB-T4

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.35 in (8.89 mm)

1.21 in (30.73 mm)

Anodized

Black

1.21 in (30.73 mm)

625-25AB-T4E

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.252 in (6.4 mm)

0.984 in (25 mm)

Anodized

Black

5.45 g

0.984 in (25 mm)

658-60AB

Ohmite Manufacturing

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.598 in (15.2 mm)

1.098 in (27.9 mm)

Anodized

Black

14.17 g

1.098 in (27.9 mm)

658-60AB-T3

Wakefield-vette

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.598 in (15.2 mm)

1.098 in (27.9 mm)

Anodized

Black

14.17 g

1.098 in (27.9 mm)

630-45AB

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.449 in (11.4 mm)

1.378 in (35 mm)

Anodized

Black

6.81 g

1.378 in (35 mm)

374724B60024G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.709 in (18 mm)

1.378 in (35 mm)

Anodized

Black

1.378 in (35 mm)

374024B00035G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Adhesive

Omnidirectional

0.394 in (10 mm)

0.906 in (23 mm)

Anodized

Black

0.906 in (23 mm)

APA501-60-001

Artesyn Embedded Technologies

Heat Sink

Pin Fin Array

Fin

Longitudinal

0.591 in (15 mm)

2.264 in (57.5 mm)

2.323 in (59 mm)

APA501-60-003

Artesyn Embedded Technologies

Heat Sink

Pin Fin Array

Fin

Longitudinal

0.902 in (22.9 mm)

2.264 in (57.5 mm)

2.323 in (59 mm)

ATS-1039-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.591 in (15 mm)

1.575 in (40 mm)

Anodized

Green

2.087 in (53 mm)

ATS-1039-C2-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.591 in (15 mm)

1.575 in (40 mm)

Anodized

Green

2.087 in (53 mm)

ATS-1042-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Flared

Omnidirectional

0.591 in (15 mm)

1.614 in (41 mm)

Anodized

Green

2.52 in (64 mm)

ATS-1042-C2-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Flared

Omnidirectional

0.591 in (15 mm)

1.614 in (41 mm)

Anodized

Green

2.52 in (64 mm)

ATS-X50400B-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.295 in (7.5 mm)

1.575 in (40 mm)

Anodized

Blue

1.575 in (40 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.