Screw Heat Sinks 9

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

HS201DR

Crydom

Heat Sink

Screw

Aluminium Alloy

Relay

Longitudinal

2 Ω

3.15 in (80 mm)

1.772 in (45 mm)

353 g

3.189 in (81 mm)

507302B00000G

Boyd

Heat Sink

Screw

Aluminium

Transistor

Fin

Transverse

24 Ω

0.38 in (9.65 mm)

0.75 in (19.05 mm)

Anodized

Black

Low Profile

0.75 in (19.05 mm)

PSD1-2CB

Cts

Heat Sink

Screw

Transistor

U

Transverse

14.4 Ω

2.18 in (55.37 mm)

0.5 in (12.7 mm)

Black

1.38 in (35.05 mm)

M-B012

Cincon Electronics

Heat Sink

Screw

Aluminium Alloy

Fin

Longitudinal

1 in (25.4 mm)

2.433 in (61.8 mm)

Black Anodized

Black

4.598 in (116.8 mm)

SK6875SA

Fischer Elektronik & Kg

Heat Sink

Screw

Transistor

Extruded

Longitudinal

5.85 Ω

1.299 in (33 mm)

1.811 in (46 mm)

Anodized

Black

2.953 in (75 mm)

SK681000SA

Fischer Elektronik & Kg

Heat Sink

Screw

Transistor

Extruded

Longitudinal

5.85 Ω

1.299 in (33 mm)

1.811 in (46 mm)

Anodized

Black

39.37 in (1000 mm)

SK68100SA

Fischer Elektronik & Kg

Heat Sink

Screw

Transistor

Extruded

Longitudinal

5.85 Ω

1.299 in (33 mm)

1.811 in (46 mm)

Anodized

Black

3.937 in (100 mm)

FK235MIL1

Fischer Elektronik & Kg

Heat Sink

Screw

Transistor

Transverse

16 Ω

1.102 in (28 mm)

0.591 in (15 mm)

0.728 in (18.5 mm)

SK12950,8STS

Fischer Elektronik & Kg

Heat Sink

Screw

Transistor

Extruded

Longitudinal

5.3 Ω

0.984 in (25 mm)

1.654 in (42 mm)

Anodized

Black

2 in (50.8 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.