U Heat Sinks 20

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Part	Manufacturer	Thermal Device Type	Profile	Body Material	Device Used On	Construction	Fin Orientation	Thermal Resistance	Height	Width	Finish	Color	Packing Method	Weight	Length
258	Wakefield Thermal Solutions	Heat Sink	U	Aluminium					0.339 in (8.6 mm)	0.252 in (6.4 mm)	Anodized	Black		820 mg	0.5 in (12.7 mm)
573300D00010G	Boyd	Heat Sink	U			Extruded			0.4 in (10.16 mm)	0.5 in (12.7 mm)	Tin/Nickel	Gray	Tape and Reel, 13 in		1.03 in (26.16 mm)
576802B04000G	Boyd	Heat Sink	U	Aluminium	Transistor	Clip		27.3 Ω	0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized	Black			0.57 in (14.48 mm)
576802B00000G	Boyd	Heat Sink	U	Aluminium		Clip	Transverse	27.3 Ω	0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized	Black			0.57 in (14.48 mm)
530613B00000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	16.7 Ω	1.18 in (29.97 mm)	0.5 in (12.7 mm)	Anodized	Black			1 in (25.4 mm)
573100D00010G	Boyd	Heat Sink	U	Copper		Fin	Longitudinal	15 Ω	0.4 in (10.16 mm)	0.315 in (8 mm)	Tin	Gray	Tape and Reel, 13 in		0.9 in (22.86 mm)
PF750G	Boyd	Heat Sink	U	Copper				20.3 Ω	0.866 in (22 mm)	0.433 in (11 mm)	Tin				0.866 in (22 mm)
577002B00000G	Boyd	Heat Sink	U	Aluminium		Fin	Longitudinal	32 Ω	0.75 in (19.05 mm)	0.25 in (6.35 mm)	Anodized	Black			0.52 in (13.21 mm)
507002B00000G	Boyd	Heat Sink	U	Aluminium		Fin	Longitudinal	15.6 Ω	0.7 in (17.78 mm)	0.375 in (9.52 mm)	Anodized	Black			1.75 in (44.45 mm)
577202B04000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	24.4 Ω	0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized	Black			0.52 in (13.21 mm)
577102B04000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	25.9 Ω	0.75 in (19.05 mm)	0.375 in (9.52 mm)	Anodized	Black			0.52 in (13.21 mm)
573300D00000G	Boyd	Heat Sink	U	Copper		Fin		18 Ω	0.4 in (10.16 mm)	0.5 in (12.7 mm)	Tin				1.03 in (26.16 mm)
7136DG	Boyd	Heat Sink	U	Copper		Clip	Transverse	19.7 Ω	0.848 in (21.54 mm)	0.515 in (13.08 mm)	Tin				0.52 in (13.21 mm)
574602B03300G	Boyd	Heat Sink	U	Aluminium		Slide On	Folded Back	21.6 Ω	0.69 in (17.53 mm)	0.355 in (9.02 mm)	Anodized	Black			0.86 in (21.84 mm)
593002B03400G	Boyd	Heat Sink	U	Aluminium		Fin		13.4 Ω	1.18 in (29.97 mm)	0.5 in (12.7 mm)	Anodized	Black			0.942 in (23.93 mm)
218-40CTE5	Wakefield-vette	Heat Sink	U	Aluminium		Fin	Folded Back		0.402 in (10.2 mm)	0.5 in (12.7 mm)	Anodized	Black			1.031 in (26.2 mm)
7140DG	Boyd	Heat Sink	U	Copper			Transverse	20.8 Ω	0.7 in (17.78 mm)	0.375 in (9.52 mm)	Tin				0.52 in (13.2 mm)
578622B03200G	Boyd	Heat Sink	U	Aluminium	Transistor	Fin	Transverse	13.2 Ω	1 in (25.4 mm)	0.5 in (12.7 mm)	Anodized	Black			1.48 in (37.59 mm)
576802B03900G	Boyd	Heat Sink	U	Aluminium		Clip	Transverse	27.3 Ω	0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized	Black			0.5 in (12.7 mm)
577002B04000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	32 Ω	0.75 in (19.05 mm)	0.25 in (6.35 mm)	Anodized	Black			0.52 in (13.21 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.