.3 A RF Power Bipolar Junction Transistors (BJT) 12

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum VCEsat Minimum Power Gain (Gp) Terminal Form Package Shape No. of Elements Highest Frequency Band No. of Terminals Package Style (Meter) Sub-Category Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Reference Standard

SD1650

STMicroelectronics

NPN

SINGLE

YES

175 W

.3 A

PLASTIC/EPOXY

AMPLIFIER

FLAT

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

6

FLANGE MOUNT

Other Transistors

20

200 Cel

SILICON

28 V

DUAL

R-PDFM-F6

Not Qualified

HIGH RELIABILITY

BFG741TRL

NXP Semiconductors

NPN

SINGLE

YES

7000 MHz

.3 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

4

SMALL OUTLINE

SILICON

15 V

DUAL

R-PDSO-G4

Not Qualified

LXE18300XTRAY

NXP Semiconductors

NPN

SINGLE

YES

.3 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

9 dB

FLAT

RECTANGULAR

1

L BAND

2

FLANGE MOUNT

SILICON

DUAL

R-CDFM-F2

Not Qualified

BFG741

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

7000 MHz

2 W

.3 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

4

SMALL OUTLINE

Other Transistors

60

175 Cel

SILICON

15 V

DUAL

R-PDSO-G4

COLLECTOR

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTOR

BFQ108

NXP Semiconductors

PNP

SINGLE

YES

4000 MHz

.3 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

4

DISK BUTTON

SILICON

18 V

RADIAL

O-CRDB-F4

Not Qualified

LXE16350XTRAY

NXP Semiconductors

NPN

SINGLE

YES

.3 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

10 dB

FLAT

RECTANGULAR

1

L BAND

2

FLANGE MOUNT

SILICON

DUAL

R-CDFM-F2

Not Qualified

BFG741TRL13

NXP Semiconductors

NPN

SINGLE

YES

7000 MHz

.3 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

4

SMALL OUTLINE

SILICON

15 V

DUAL

R-PDSO-G4

Not Qualified

BFQ741

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

7000 MHz

4 W

.3 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

DISK BUTTON

Other Transistors

120

200 Cel

SILICON

19 V

RADIAL

O-CRDB-F4

EMITTER

Not Qualified

WITH EMITTER BALLASTING RESISTORS

BFG235E6327

Infineon Technologies

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

5500 MHz

2 W

.3 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

L BAND

4

SMALL OUTLINE

Other Transistors

75

150 Cel

3.6 pF

SILICON

15 V

DUAL

R-PDSO-G4

COLLECTOR

Not Qualified

BUILT IN EMITTER BALLASTING RESISTOR

NOT SPECIFIED

NOT SPECIFIED

NE69039

Renesas Electronics

NPN

SINGLE

YES

.3 A

PLASTIC/EPOXY

AMPLIFIER

5 dB

GULL WING

RECTANGULAR

1

L BAND

4

SMALL OUTLINE

.2 W

60

150 Cel

SILICON

6 V

DUAL

R-PDSO-G4

COLLECTOR

NE69039FB

Renesas Electronics

NPN

SINGLE

YES

.3 A

PLASTIC/EPOXY

AMPLIFIER

5 dB

GULL WING

RECTANGULAR

1

L BAND

4

SMALL OUTLINE

.2 W

150 Cel

SILICON

6 V

DUAL

R-PDSO-G4

COLLECTOR

KSC5035

Samsung

NPN

SINGLE

NO

500 MHz

8 W

.3 A

PLASTIC/EPOXY

THROUGH-HOLE

RECTANGULAR

1

3

FLANGE MOUNT

Other Transistors

40

150 Cel

SILICON

SINGLE

R-PSFM-T3

ISOLATED

Not Qualified

TO-126

RF Power Bipolar Junction Transistors (BJT)

RF Power Bipolar Junction Transistors (BJT) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.

RF Power BJTs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.

The RF Power BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.

RF Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.

Proper selection and use of RF Power BJTs are critical to ensure optimal performance, reliability, and compatibility with other components in the circuit. RF Power BJTs are often used in conjunction with other components, such as filters and matching networks, to form complete RF power amplification circuits.