1 A RF Power Bipolar Junction Transistors (BJT) 18

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum VCEsat Minimum Power Gain (Gp) Terminal Form Package Shape No. of Elements Highest Frequency Band No. of Terminals Package Style (Meter) Sub-Category Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Reference Standard

2005

Microsemi

NPN

SINGLE

YES

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

RECTANGULAR

1

L BAND

2

FLANGE MOUNT

200 Cel

SILICON

TIN LEAD

DUAL

R-CDFM-F2

Not Qualified

HIGH RELIABILITY

e0

C3-28

Asi Semiconductor

NPN

SINGLE

NO

600 MHz

10 W

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

POST/STUD MOUNT

Other Transistors

200 Cel

7 pF

SILICON

RADIAL

O-CRPM-F4

Not Qualified

2N5641

STMicroelectronics

NPN

SINGLE

NO

300 MHz

15 W

1 A

UNSPECIFIED

AMPLIFIER

FLAT

ROUND

1

VERY HIGH FREQUENCY BAND

4

POST/STUD MOUNT

Other Transistors

5

200 Cel

15 pF

SILICON

35 V

RADIAL

O-XRPM-F4

2N4041

Texas Instruments

NPN

SINGLE

YES

400 MHz

18 W

1 A

CERAMIC, METAL-SEALED COFIRED

FLAT

ROUND

1

4

DISK BUTTON

Other Transistors

10

175 Cel

SILICON

40 V

RADIAL

O-CRDB-F4

Not Qualified

TO-117

AM80814-005

STMicroelectronics

NPN

SINGLE

YES

23 W

1 A

CERAMIC, METAL-SEALED COFIRED

SWITCHING

8.5 dB

FLAT

RECTANGULAR

1

L BAND

2

FLANGE MOUNT

Other Transistors

30

250 Cel

SILICON

DUAL

R-CDFM-F2

BASE

Not Qualified

HIGH RELIABILITY

MSC81058

STMicroelectronics

NPN

SINGLE

NO

29 W

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

L BAND

2

FLANGE MOUNT

Other Transistors

15

200 Cel

10 pF

SILICON

RADIAL

O-CRFM-F2

BASE

Not Qualified

MSC82005

STMicroelectronics

NPN

SINGLE

NO

29 W

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

L BAND

2

FLANGE MOUNT

Other Transistors

15

200 Cel

10 pF

SILICON

RADIAL

O-CRFM-F2

BASE

Not Qualified

MSC81010

STMicroelectronics

NPN

SINGLE

NO

29 W

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

L BAND

2

POST/STUD MOUNT

Other Transistors

15

200 Cel

10 pF

SILICON

RADIAL

O-CRPM-F2

BASE

Not Qualified

2N3733

STMicroelectronics

NPN

SINGLE

NO

23 W

1 A

1

Other Transistors

10

175 Cel

BLW80

NXP Semiconductors

NPN

SINGLE

NO

1250 MHz

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

POST/STUD MOUNT

17 W

10

200 Cel

SILICON

17 V

RADIAL

O-CRPM-F4

Not Qualified

PVB42004X

NXP Semiconductors

NPN

SINGLE

YES

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

RECTANGULAR

1

C BAND

2

FLANGE MOUNT

18 W

200 Cel

SILICON

15 V

DUAL

R-CDFM-F2

BASE

Not Qualified

BLX68

NXP Semiconductors

NPN

SINGLE

NO

1 A

PLASTIC/EPOXY

AMPLIFIER

5.4 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

POST/STUD MOUNT

150 Cel

SILICON

18 V

RADIAL

O-PRPM-F4

ISOLATED

Not Qualified

RV3135B5X

NXP Semiconductors

NPN

SINGLE

YES

25 W

1 A

CERAMIC, METAL-SEALED COFIRED

4.3 dB

FLAT

RECTANGULAR

1

S BAND

2

FLANGE MOUNT

Other Transistors

200 Cel

SILICON

DUAL

R-CDFM-F2

Not Qualified

BLX93A

NXP Semiconductors

NPN

SINGLE

NO

1200 MHz

1 A

PLASTIC/EPOXY

AMPLIFIER

8.5 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

POST/STUD MOUNT

10

200 Cel

SILICON

33 V

RADIAL

O-PRPM-F4

ISOLATED

Not Qualified

HIGH RELIABILITY

PTB20216

Infineon Technologies

NPN

SINGLE

YES

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

NO LEAD

RECTANGULAR

1

L BAND

3

CHIP CARRIER

SILICON

20 V

MATTE TIN

QUAD

R-CQCC-N3

Not Qualified

HIGH RELIABILITY

e3

PTB20228

Infineon Technologies

NPN

SINGLE

YES

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

NO LEAD

RECTANGULAR

1

L BAND

3

CHIP CARRIER

SILICON

20 V

MATTE TIN

QUAD

R-CQCC-N3

Not Qualified

HIGH RELIABILITY

e3

2SC1169

Toshiba

NPN

SINGLE

NO

1 A

METAL

AMPLIFIER

PIN/PEG

ROUND

1

VERY HIGH FREQUENCY BAND

3

FLANGE MOUNT

10 pF

SILICON

20 V

TIN LEAD

BOTTOM

O-MBFM-P3

EMITTER

Not Qualified

e0

2SC3006

Toshiba

NPN

SINGLE

YES

10 W

1 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8.8 dB

FLAT

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

4

FLANGE MOUNT

Other Transistors

10 W

10

175 Cel

SILICON

17 V

DUAL

R-CDFM-F4

Not Qualified

RF Power Bipolar Junction Transistors (BJT)

RF Power Bipolar Junction Transistors (BJT) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.

RF Power BJTs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.

The RF Power BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.

RF Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.

Proper selection and use of RF Power BJTs are critical to ensure optimal performance, reliability, and compatibility with other components in the circuit. RF Power BJTs are often used in conjunction with other components, such as filters and matching networks, to form complete RF power amplification circuits.